Design / Tapeout / Packaging / Testing
Start with the stage of your project. Use TOMPW checks and calculators here, or follow a clearly labeled link to a provider's own software or reference material. TOMPW browser checks keep input content local; optional Python readers run on your machine.
Official resources open on the provider's website in a new tab. They are not TOMPW tools or partnership endorsements. Software, technical references and access information are labeled separately.
We do not host vendor software, models or PDKs. Check the provider's current license, access requirements and data policies; never submit confidential project files without authorization.
Directory reviewed . Availability and terms may change.
01 / 2 TOMPW tools / 4 official resources
IP delivery, circuit evaluation and integration planning.
TOMPW / Local input check
Check third-party IP delivery views and responsibilities. Optionally match local files against a trusted manifest using SHA256, size and relative path.
Open local-processing check →TOMPW / Planning calculator
Model IP licence fees, per-die royalties, support and integration effort across program volume — with the buy-vs-build break-even point.
Open calculator →Texas Instruments / Vendor software
Analog circuit calculations for amplifier, converter and PCB planning.
Analog Devices / Vendor software
RF chain and frequency-synthesis evaluation resources, including ADIsimRF.
Arm / Vendor software
Configuration and integration tooling for Arm System IP.
Synopsys / Vendor software
IP configuration, packaging and integration resources using IP-XACT and AMBA workflows.
02 / 7 TOMPW tools / 3 official resources
Layout handoff, MPW fit, foundry access and program cost planning.
TOMPW / Local input check
Check die width, height, permitted rotation and per-edge margins against a booked MPW block. Area alone is not a fit test.
Open local-processing check →TOMPW / Local input check
Read GDSII record metadata, units, cells, layer/datatype pairs and unresolved or cyclic cell references without uploading or rewriting the file.
Open local-processing check →TOMPW / Planning calculator
Count complete dies from Shot/Field layouts with flat or notched wafer boundaries, edge clearance and optional yield estimates.
Open calculator →TOMPW / Planning calculator
Allocate an agreed MPW shared cost by booked block area and block count, without predicting delivered dies.
Open calculator →TOMPW / Planning calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open calculator →TOMPW / Planning calculator
Compare dies per wafer and cost per die across 100/150/200/300 mm wafers for a fixed die.
Open calculator →TOMPW / Planning calculator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open calculator →GlobalFoundries / PDK access information
PDK and design-flow information for foundry-specific implementation and verification.
Samsung Foundry / Foundry ecosystem information
Reference-flow and EDA certification information for Samsung Foundry design handoffs.
TSMC / Foundry ecosystem information
Foundry reference-flow and certified EDA ecosystem information.
03 / 2 TOMPW tools / 3 official resources
Pad-to-pin handoff, package choices and thermal reference material.
TOMPW / Local input check
Check pad-to-pin mapping and orientation, compare packaging revisions and overlay 2D bond sketches before an OSAT handoff.
Open local-processing check →TOMPW / Planning calculator
Match QFN, BGA, WLCSP, Flip-Chip, SiP or legacy leaded packages to your IO, power, RF, cost and form-factor constraints.
Open calculator →Samsung Foundry / Technical reference
Multi-die structure descriptions and early packaging design resources.
Amkor / Technical reference
Electrical, thermal and mechanical characterization information for package evaluation.
Texas Instruments / Technical reference
PDF guidance on interpreting package thermal metrics and their test conditions.
04 / 3 TOMPW tools / 2 official resources
Measurement files, wafer maps, instrument setup and test cost planning.
TOMPW / Local input check
View one- and two-port S-parameter magnitude and phase. Compare files only with matching frequency grids, reference resistance and declared conditions.
Open local-processing check →TOMPW / Local input check
Map explicit PASS, FAIL and EXCLUDE die coordinates. Resolve retests only with a stated policy and show exactly which sites enter the yield denominator.
Open local-processing check →TOMPW / Planning calculator
Estimate ATE test cost per device and per good unit from tester rate, test time, handler cost, volume and test yield.
Open calculator →Texas Instruments / Vendor software
Capture and analyze supported TI ADC, DAC and AFE evaluation data.
Keysight / Vendor software
Instrument discovery, interface setup and communication libraries for supported test setups.
Disclaimer: This tool and its outputs are for reference and preliminary evaluation only, not design, manufacturing, qualification or commercial approval; verify all results with the responsible supplier or engineer.
