FIRST-SILICON CONFIDENCE
Verification That Reduces Expensive Silicon Surprises
Verification quality directly affects tape-out confidence. TOMPW helps connect design intent, verification strategy and the manufacturing consequences of missing bugs.
Included Scope
What this service is built to handle
- Functional verification planning
- Coverage and corner-case review
- Validation preparation for silicon bring-up
- Coordination with DFT, test and post-silicon teams
Best Fit
Common situations where this path makes sense
- ASIC teams approaching tape-out freeze
- Programs mixing internal design with external implementation help
- Products with expensive respin risk
Deliverables
Typical outputs from TOMPW coordination
- Verification scope review
- Coverage and risk checklist
- Validation handoff notes
- Post-silicon readiness alignment
ENGAGEMENT MODEL
How Design Verification runs stage by stage
Verification effort is finite, so the useful question is not whether a design is fully verified. It is whether the right corners got the effort that was available.
Stage 1
Coverage planning
What we need from you
- • Design intent and failure modes that matter most
- • Existing verification assets, if any
- • Known weak areas from previous revisions
What TOMPW handles
- • Feature list mapped to coverage goals
- • Prioritised corner list
- • Agreement on where effort stops
Exit gate: Coverage plan accepted by both sides.
Stage 2
Execution and closure
What we need from you
- • Environment and regression capacity
- • Bug triage owner
- • Definition of done for each check
What TOMPW handles
- • Regression structure and reporting cadence
- • Bug triage pack with severity mapping
- • Coverage closure evidence
Exit gate: Remaining bugs are documented as accepted risks.
Stage 3
Silicon readiness
What we need from you
- • Bring-up plan for first silicon
- • Debug instrumentation expectations
- • Test access considerations
What TOMPW handles
- • Bring-up checklist tied to verification gaps
- • Debug plan for the likely failure modes
- • Handoff notes for the test team
Exit gate: Tape-out approved with known risks on record.
Verification planning is most valuable before implementation finishes. Teams arriving late usually buy less coverage for the same money.
Limits worth agreeing before you commit
- • Verification cannot prove absence of bugs; it bounds the risk that was affordable.
- • Results are tied to the testbench and models used, and should be re-run after specification changes.
- • Silicon behaviour can still differ from simulation, particularly for analog and mixed-signal paths.
Execution Notes
Commercially important details buyers usually ask later
- Verification scope should track product risk, not only block-level completion.
- Bring-up and test assumptions need to be part of the verification conversation early.
- This page avoids over-claiming exact methodologies when the final customer flow varies.
Next Move
Share node, schedule and downstream requirements together
The right recommendation depends on more than one keyword. For example, package, CP, FT and sample goals often change whether MPW, NTO or a broader turnkey path makes the most sense.
Email project contextFAQ
Questions buyers ask around Design Verification
At minimum: the verification plan with coverage targets, regression results on the final netlist, CDC/RDC and low-power checks where they apply, and static timing sign-off against the foundry rules for your operating corners. TOMPW works through this list with you before submission and flags which items are still open rather than assuming they are done.
Yes. Escaped bugs can force respins, schedule slip and repeated packaging or test spend. Stronger verification planning usually lowers total program risk and avoids the most expensive failure mode: discovering a bug after wafers return.
Related Services
Adjacent steps in the same silicon program
ARCHITECTURE TO RTL
ASIC / SoC Design
Support architecture, RTL and integration planning for teams moving from specification to implementation.
CP · FT · RELIABILITY
Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
ONE PARTNER · FULL DELIVERY PATH
Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
FOUNDRY COVERAGE
Foundry profiles to compare for this path
Compare public technology profiles for Design Verification, from advanced logic to mature analog, compound and specialty processes. PDK access, contracting route and current availability are confirmed for each project.
PLANNING TOOLS
Calculators that support Design Verification
Estimate dies per wafer, split shared-mask cost and model unit economics for this path.