FAQ
Questions chip teams actually ask before they buy
This page answers practical questions around MPW, foundry choice, packaging, test and turnkey delivery, rather than repeating generic slogans.
The site is built for semiconductor teams worldwide who need foundry access, tape-out execution and downstream packaging or test support without managing many separate suppliers. It suits both first-time ASIC teams and experienced groups outsourcing part of the chain.
No. The broader value proposition includes MPW, NTO, full mask, packaging, test, PCB support, firmware support and turnkey execution coordination. TOMPW acts as an execution partner across the delivery chain, not only a wafer-order channel.
The current coverage spans 12nm to 3um, with some sub-7nm opportunities handled case by case. Node support is matched to each program through the foundry and MPW pages, so the range reflects real accessible platforms rather than a fixed catalog.
Start with the service pages to understand scope, then the foundry and MPW sections for process and scheduling context, then the guides for packaging, test and turnkey decisions. Each page is written to answer a concrete engineering or sourcing question, so you can move from question to scoped quote.
The best first step is to share your application, target node, desired volume and current project stage by email. With those inputs, TOMPW can scope the right path quickly between MPW, NTO, full mask and turnkey support for your program.
Choose MPW when your priority is low-cost first silicon and design learning rather than volume efficiency. It is the standard entry point for prototypes, design validation and early customer sampling before committing to a dedicated full-mask production run.
No. TOMPW can also review your tape-out package, coordinate foundry communication and extend the flow into packaging, test and logistics when needed. Most customers use it as an execution partner, not only a wafer-order channel.
Yes. Packaging is often the next decision after first silicon, and it should be planned before wafers are delivered to avoid idle time. TOMPW can arrange assembly, dicing and inspection for MPW blocks as well as full-mask wafers.
Because package choice, sample readiness and qualification flow are downstream decisions that shape cost and schedule. Planning them early avoids idle time after wafers return and prevents rework once the first samples are already in hand, protecting your tape-out investment.
On this site, turnkey means TOMPW coordinates the broader chain — design support, tape-out, manufacturing, packaging, test and delivery — instead of only one isolated stage. One partner owns the handoffs so the program stays coherent end to end.
No. It can be especially useful for smaller teams that need one operational bridge into the semiconductor supply chain. Turnkey scope can start with a single stage and expand as the program matures, so it fits both startups and larger programs.