Questions chip teams actually ask before they buy

TOMPW can enter at architecture and design, at netlist or GDS handoff, at tape-out and shuttle booking, or at packaging and test. What you need to provide depends on the entry point: usually the target node or an acceptable range, die size or a working estimate, package and test expectations, target quantity, and the dates that matter to you. Teams new to tape-out can start from a rough description and we will help shape the rest.

No. The broader value proposition includes MPW, NTO, full mask, packaging, test, PCB support, firmware support and turnkey execution coordination. TOMPW acts as an execution partner across the delivery chain, not only a wafer-order channel.

The current coverage spans 12nm to 3um, with some sub-7nm opportunities handled case by case. Node support is matched to each program through the foundry and MPW pages, so the range reflects real accessible platforms rather than a fixed catalog.

Start with the service pages to understand scope, then the foundry and MPW sections for process and scheduling context, then the guides for packaging, test and turnkey decisions. Each page is written to answer a concrete engineering or sourcing question, so you can move from question to scoped quote.

The best first step is to share your application, target node, desired volume and current project stage by email. With those inputs, TOMPW can scope the right path quickly between MPW, NTO, full mask and turnkey support for your program.

Yes, in ranges. As wide industry reference points: an MPW seat runs roughly US$3,000–$30,000 on mature nodes, US$8,000–$80,000 from 130nm to 55nm, US$25,000–$200,000 from 40nm to 28nm and US$50,000–$400,000 at 22nm and below. Mask sets, wafers, packaging, test and IP each have their own ranges. These are deliberately wide because season, capacity, die size, block count, metal stack and currency all move the number — they are orientation, not a quotation. The full list with the disclaimer is on the cost ranges page, and a project-specific number comes from a written quote.

The MPW schedule page carries the calendars UMC, X-FAB, GlobalFoundries and IHP publish themselves, laid out as process-by-month grids with the tape-in or launch dates they list, plus the source link and the date each table was last checked. X-FAB and IHP publish day-level tape-in dates; UMC and GlobalFoundries publish launch months that launch only once minimum demand is met. Foundries that release dates only to customers — including TSMC, SMIC and Samsung — are listed separately, and the current window is confirmed per project.

Choose MPW when your priority is low-cost first silicon and design learning rather than volume efficiency. It is the standard entry point for prototypes, design validation and early customer sampling before committing to a dedicated full-mask production run.

No. TOMPW can also review your tape-out package, coordinate foundry communication and extend the flow into packaging, test and logistics when needed. Most customers use it as an execution partner, not only a wafer-order channel.

Yes. Packaging is often the next decision after first silicon, and it should be planned before wafers are delivered to avoid idle time. TOMPW can arrange assembly, dicing and inspection for MPW blocks as well as full-mask wafers.

Because package choice, sample readiness and qualification flow are downstream decisions that shape cost and schedule. Planning them early avoids idle time after wafers return and prevents rework once the first samples are already in hand, protecting your tape-out investment.

On this site, turnkey means TOMPW coordinates the broader chain — design support, tape-out, manufacturing, packaging, test and delivery — instead of only one isolated stage. One partner owns the handoffs so the program stays coherent end to end.

No. It can be especially useful for smaller teams that need one operational bridge into the semiconductor supply chain. Turnkey scope can start with a single stage and expand as the program matures, so it fits both startups and larger programs.

Yes, and it is common. Scope can open at design handoff, tape-out, package build or the sample stage, then expand once those handoffs are working. Entering late usually means fewer stages sit inside TOMPW scope, not a different access level.

Enough to place the program: product intent or block diagram, node preference if one exists, package direction, expected volume ramp and the dates that are genuinely fixed. Existing design data helps, but it is not required to start scoping.

It changes what is being paid for rather than simply adding a layer. Managing tenders, schedule conflicts and handoff gaps internally also carries cost, and that cost is usually hidden inside engineering time. Comparing both paths properly means pricing them against the same scope.

Volume release can sit inside the scope. The model covers the ramp plan, the qualified vendor set and shipping documentation, while underlying pricing and lead times follow the foundry and OSAT terms agreed for your specific lots.