ASSEMBLY PATH TO SHIPPABLE PRODUCT

Packaging Support That Starts Before Wafers Arrive

Packaging is often where prototype momentum slows down. TOMPW helps customers think through package choice, assembly coordination and the transition into test and delivery.

Teams moving from bare wafer to evaluated productProducts where package form factor affects electrical or thermal behaviorCustomers that need one coordinator across assembly and test suppliers

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Packaged semiconductor devices used to illustrate packaging services

PACKAGE FAMILIES

Common forms TOMPW helps plan and coordinate

Package choice shapes electrical, thermal and board behavior. The ranges below are typical industry planning ranges, not TOMPW specifications.

Family	Full name	Typical IO	Typical pitch	Typical use
QFN / DFN	Quad / Dual Flat No-lead	6 – 100	0.4 – 0.65 mm	Leadless with exposed-pad thermal path; common for analog, RF, mixed-signal and power devices.
SOP / SSOP / SOT	Small-outline leaded	3 – 28	0.635 – 1.27 mm	Leaded, easy board assembly; sensors, low/mid-IO logic, LDO and PMIC devices.
BGA / LGA	Ball / Land Grid Array	up to several hundred	0.4 – 1.0 mm	Area-array for higher IO density and better electrical/thermal behavior; ASIC, SoC, FPGA.
WLCSP	Wafer-Level Chip Scale	varies by die	0.35 – 0.5 mm	Die-size package with the shortest interconnect; space/power-constrained mobile and RF devices.
Flip-Chip	Flip-Chip bump	high	sub-150 µm bumps	Face-down bumps for best high-frequency and thermal performance; often under a BGA or on board.
SiP / Heterogeneous	System-in-Package	module-dependent	—	Multiple dice and passives in one module; RF front-ends, sensor hubs, power modules.

Compare package types side by side Open Package Selection Advisor

Included Scope

What this service is built to handle

Planning across common package families such as QFN/DFN, SOP/SSOP/SOT, BGA/LGA, WLCSP, flip-chip and SiP-type modules
Quick-turn prototype assembly: die attach, wire bond and plastic mold for engineering lots
Wafer backgrind and dicing of full-mask and MPW blocks across silicon, glass, sapphire and substrate
Inspection and failure analysis: 2D/3D X-ray, C-SAM/SAT, decap, cross-section and layer removal
Reliability and qualification path: HTOL/HAST/burn-in, ESD (HBM/CDM/Latch-up) and AEC-Q100/Q101-style automotive prep
Coordination with CP, FT, SLT and downstream board-level evaluation

Best Fit

Common situations where this path makes sense

Teams moving from bare wafer to evaluated product
Products where package form factor affects electrical or thermal behavior
Customers that need one coordinator across assembly and test suppliers

Deliverables

Typical outputs from TOMPW coordination

Package path recommendation inputs
Assembly coordination
Package and test handoff alignment
Sample delivery support

CAPABILITY DETAIL

From package choice to measurable, qualified samples

Package family selection & planning

Early alignment of package choice with die pad layout, thermal budget, board footprint and downstream test or qualification needs. Covers QFN/DFN, SOP/SSOP/SOT, BGA/LGA, WLCSP, Flip-Chip and SiP-type modules.

Quick-turn prototype packaging

Rapid plastic-mold assembly for DFN/QFN and similar leadless forms, plus die attach and wire bonding for engineering lots. Indicative short lead times are available for prototype batches; the exact schedule is confirmed per project and depends on wire type, mold compound and line loading.

Wafer backgrind & dicing

Thinning of 8-inch and 12-inch wafers to thin profiles, and dicing of full-mask and MPW blocks across silicon, glass, sapphire and substrate materials. Street width, tape choice and thin-wafer handling are planned together with the assembly step.

Die attach, wire bond & molding

Substrate and leadframe options, gold and copper wire bonding, and plastic molding for common leadless and leaded forms. Bumping and substrate-based advanced forms are coordinated through the appropriate assembly partner in the network.

Inspection & failure analysis

Non-destructive and physical analysis available as standalone work or as part of debug: 2D/3D X-ray, C-SAM/SAT acoustic imaging, decapsulation, cross-section/polish and layer removal. Useful for incoming inspection, field-return analysis and process learning.

Reliability & qualification path

Preparation for operational-life, moisture and environmental stress flows such as HTOL/HAST/burn-in, ESD characterization (HBM/CDM/Latch-up) and automotive-grade preparation aligned with AEC-Q100/Q101-style requirements. Plans are scoped per device and end market.

Test coordination

Wafer sort (CP), final test (FT) and system-level test (SLT) planning, load-board and handler alignment, and ATE platform coordination so packaged silicon is measurable and debuggable before customer evaluation.

ENGAGEMENT PATTERNS

Typical shapes of packaging work

The examples below describe representative forms of engagement. They are illustrative of the type of work and are not specific client records, names, volumes or results.

RF / mixed-signal QFN quick-turn prototype

An early-stage fabless team needed first packaged samples of an RF transceiver in a leadless QFN to begin board evaluation. TOMPW coordinated die singulation, gold wire bond and plastic mold on a short prototype lead time, then handed off to final test.

BGA field-return failure analysis

A shipped module exhibited intermittent behavior. Non-destructive 2D/3D X-ray and C-SAM located a suspected anomaly, followed by decap and cross-section to confirm the failure mechanism — feeding a corrective-action loop without disclosing the end customer.

Power IC DFN wire-bond prototype

A power-management device targeted a thermally enhanced DFN. TOMPW arranged thin-wafer handling, copper wire bond and exposed-pad molding so the team could validate thermal and electrical behavior on real samples.

Automotive-sensor reliability prep

A sensor entering a vehicle platform needed automotive-grade reliability evidence. TOMPW helped structure HTOL/HAST and ESD characterization aligned with AEC-Q100/Q101-style flows and a defined sample plan.

Execution Notes

Commercially important details buyers usually ask later

Package choice should be aligned with test, board and end-market qualification needs from the start.
Lead times for prototype assembly are indicative and confirmed per project based on wire type, mold compound and line loading.
Inspection and failure analysis can be arranged as standalone work or as part of a broader debug engagement.
Packaging pages are commercially important because many buyers search by package constraint rather than by foundry keyword alone.

Next Move

Share node, schedule and downstream requirements together

The right recommendation depends on more than one keyword. Package, CP, FT and sample goals often change whether MPW, NTO or a broader turnkey path makes the most sense.

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FAQ

Questions buyers ask around packaging

Yes. Packaging is often the next decision after first silicon, and planning it before wafers are delivered avoids idle time and rework once samples are in hand.

Common leadless (QFN/DFN), leaded (SOP/SSOP/SOT), area-array (BGA/LGA), wafer-level (WLCSP), flip-chip and SiP-type modules. The right choice depends on IO count, pitch, thermal budget and board constraints.

Short indicative lead times are available for prototype batches of plastic-mold leadless and leaded forms with die attach and wire bonding. The exact schedule is confirmed per project based on wire type, mold compound and line loading.

Yes. 2D/3D X-ray, C-SAM/SAT, decapsulation, cross-section and layer removal can be arranged on their own or as part of a broader debug engagement.

TOMPW can help structure HTOL/HAST/burn-in, ESD (HBM/CDM/Latch-up) and AEC-Q100/Q101-style automotive preparation with a defined sample and test plan.

Package choice, sample readiness and qualification flow are downstream decisions that shape cost and schedule. Planning them early avoids idle time after wafers return and prevents rework once the first samples are already in hand.

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