Free planning tool
IC Package Selection Advisor
Pick the right package before you commit a substrate. Enter your IO count, power, RF needs, cost priority and size constraints — the advisor ranks QFN, BGA, WLCSP, Flip-Chip, SiP and legacy leaded packages and shows why.
Recommended package
QFN (Quad Flat No-lead)
Best default for analog / RF / mixed-signal up to ~100 IO; exposed pad handles heat.
- IO range fits 48
Best fit
QFN
score 7
Option
SOIC
score 7
Option
BGA
score 4
| Package | IO | Thermal | RF | Cost |
|---|---|---|---|---|
| QFN (Quad Flat No-lead)★ | 8–100 | Good (exposed pad) | Good (short bonds) | Low |
| SOIC / TSSOP (Leaded legacy) | 8–56 | Poor | Poor (long bonds) | Very low |
| BGA (Ball Grid Array) | 40–1500 | Very good (thermal balls) | Good (short traces) | Medium |
| WLCSP (Wafer-Level CSP) | 4–200 | Limited (no substrate) | Excellent (no wirebond) | Low–Medium |
| Flip-Chip | 20–2000 | Excellent (direct attach) | Excellent (no wirebond) | Medium–High |
| SiP (System-in-Package) | 20–1000 | Variable | Good | High |
Scoring balances IO fit, thermal and RF needs, cost priority and form-factor. It is a planning aid — finalize with your OSAT against the actual die size, board stack-up and test plan.
Disclaimer: This tool and its outputs are for reference and preliminary evaluation only, not design, manufacturing, qualification or commercial approval; verify all results with the responsible supplier or engineer.
HOW TO READ THIS
What drives the recommendation
- IO count is the first filter — legacy leaded and QFN cap out around 56–100 IO; BGA and Flip-Chip scale into the thousands.
- Thermal favors an exposed-pad QFN for moderate loads and BGA / Flip-Chip for high power.
- RF / high frequency penalizes wirebond packages (SOIC, QFN) and rewards WLCSP / Flip-Chip with no bond-wire parasitics.
- Cost vs performance shifts the ranking toward leadframe and QFN or toward Flip-Chip and SiP respectively.
Need a substrate, wirebond or flip-chip quote from a qualified OSAT? Request a quote and we will match your die to available packaging capacity.
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Related execution paths
These are industry reference ranges, not a quotation and not an offer.
- Every band on this page is deliberately wide. It is published so you can sanity-check whether a programme is realistic before you write to anyone — not so you can budget against it.
- Actual pricing moves with the season and with capacity. Foundry and OSAT utilisation changes month to month, and a window that is cheap in a soft quarter can be materially more expensive in a tight one.
- Mask, substrate, leadframe, gold, copper and tester-time costs all move independently of the node you chose.