Foundry profile
X-FABPublic technology profile · process fit · project review
X-FAB publishes specialty analog, HV CMOS, SOI and MEMS technologies alongside 150mm SiC and 200mm GaN-on-Si foundry processes. Its open XG035 dMode GaN platform and customer-specific wide-bandgap development paths have different entry requirements.
Process Nodes
Technologies & Platforms
Project review scope
Best For
Notes
- Official process capability is a reference for feasibility enquiries; TOMPW access, PDK eligibility and commercial engagement require confirmation.
- XG035 dMode is an open foundry platform. Customer-specific eMode is a separate path and must not be treated as a generally available MPW option.
- SiC process-block development is distinct from a standard CMOS MPW design flow. Device design, qualification responsibilities and process scope need review.
- Confirm current modules, acceptance, price and timing with the foundry before committing a project.
Official capability references
- X-FAB SiC and GaN technology →
- XG035 dMode GaN-on-Si foundry announcement →
- XbloX SiC MOSFET platform →
- Current X-FAB prototyping information →
Public technology information supports process comparison. It does not confirm a TOMPW partnership, commercial access or an available production slot.
Plan the manufacturing route
Compare the process requirements with the package and test path before selecting a manufacturing route. Confirm the PDK, supplier acceptance, commercial terms and delivery scope in the project proposal.
Discuss X-FAB for Your Program
Share the application, process requirements and target quantities. TOMPW will review feasibility and identify the access, package and test conditions to confirm for X-FAB.
Email for a QuoteCOMMON QUESTIONS
Planning a X-FAB project
Can TOMPW arrange MPW or shuttle runs at X-FAB?
This profile summarizes X-FAB public capabilities for initial process selection. TOMPW can review the requirements; process modules, PDK eligibility, access and contracting route, and current MPW or dedicated-run availability require project confirmation before a proposal.
What support does TOMPW provide beyond the wafer at X-FAB?
TOMPW can scope packaging, final test, PCB and assembly work alongside the wafer requirements. The package route, responsible suppliers, test coverage and acceptance criteria are agreed in the project proposal.
How do I get a quote for a X-FAB engagement?
Email market@tompwservice.com with the application, target process, program stage, volume and package or test needs. Start with non-confidential requirements; design files can follow through an agreed secure handoff.
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RELATED SERVICES
Services that pair with a X-FAB engagement
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Semiconductor packaging through external assembly and test providers, with TOMPW coordinating package selection, supplier review and assembly-to-test handoff.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →PUBLIC MPW PLANNING REFERENCE
Compare X-FAB process nodes for MPW planning
Compare the listed X-FAB nodes using public process and general MPW planning context. The pages support a feasibility enquiry; process modules, PDK eligibility, access and contracting route, and current run availability require project confirmation.