Public process / MPW planning reference
X-FAB 0.11μm MPW planning reference
Review the X-FAB 0.11μm process alongside general MPW planning context. TOMPW can assess application fit and downstream package or test needs. Process modules, PDK eligibility, access and contracting route, and current run availability require project confirmation.
Why 0.11μm
0.11μm is one of the process options TOMPW coordinates as a shared-mask MPW run at the partner foundry. We handle slot selection, EDA checks and logistics so your design reaches the line on schedule.
Questions for 0.11μm MPW planning at X-FAB
MPW generally places several designs on a shared mask set. For a possible X-FAB 0.11μm project, first establish the exact platform, eligible modules, design rules and design acceptance; then assess mask allocation, fabrication scope and downstream delivery requirements.
Step 1
Application & process fit
Share non-confidential requirements, target node and program stage.
Step 2
Eligibility & route
Confirm process modules, PDK eligibility, contracting route and current run options.
Step 3
Delivery scope
Define wafer, package and test requirements and acceptance criteria.
Platforms across X-FAB
Foundry-level platforms, not a list of everything 0.11μm offers. Which of these apply to a prospective 0.11μm project is confirmed per project.
Public reference conditions
- Official process capability is a reference for feasibility enquiries; TOMPW access, PDK eligibility and commercial engagement require confirmation.
- XG035 dMode is an open foundry platform. Customer-specific eMode is a separate path and must not be treated as a generally available MPW option.
- SiC process-block development is distinct from a standard CMOS MPW design flow. Device design, qualification responsibilities and process scope need review.
- Confirm current modules, acceptance, price and timing with the foundry before committing a project.
Best-fit applications
Expert reviewed
This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.
Discuss 0.11μm process fit at X-FAB
Share application, process and downstream requirements for an initial feasibility review.
Discuss process feasibilityCOMMON QUESTIONS
Planning questions for X-FAB 0.11μm
Does this page confirm 0.11μm MPW access at X-FAB?
This is a public process and MPW planning reference. TOMPW can review the application and manufacturing requirements; process modules, PDK eligibility, access and contracting route, and current run availability require project confirmation. A listed node does not establish a bookable shuttle or authorized access.
What should I confirm for a possible 0.11μm MPW at X-FAB?
Confirm the exact process and modules, design rules, project eligibility, die and mask allocation, and fabrication scope. Probe coverage, packaging, final test and acceptance criteria need separate agreement. Foundry-wide capabilities on this page do not all apply to the 0.11μm node.
Is there a current 0.11μm shuttle date at X-FAB?
This page does not publish a confirmed run date. Ask for the current platform offering, design submission requirements and delivery estimate for the specific project before setting a tape-out plan.
How can TOMPW help assess a X-FAB project?
Share non-confidential application requirements, the target node, program stage, quantities and package or test needs. TOMPW can prepare a process-fit review and identify the technical and commercial questions to resolve before selecting a manufacturing route.
PLAN & ESTIMATE
Calculators for 0.11μm planning
Use general calculators to compare die counts and cost assumptions. Their outputs do not establish a foundry offering, price or run allocation.
Die Per Wafer Calculator
Count complete dies from Shot/Field layouts with flat or notched wafer boundaries, edge clearance and optional yield estimates.
Open tool →MPW Cost Sharing Calculator
Allocate an agreed MPW shared cost by booked block area and block count, without predicting delivered dies.
Open tool →Wafer & Unit Cost Calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open tool →Tape-out Budget Estimator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open tool →RELATED FOUNDRY PROFILES
Other foundries teams compare X-FAB with
RELATED SERVICES
Services to consider in a manufacturing plan
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Semiconductor packaging through external assembly and test providers, with TOMPW coordinating package selection, supplier review and assembly-to-test handoff.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →RELATED MPW NODES
Other 0.11μm and X-FAB MPW planning pages
Browse related process references for application and manufacturing-route comparisons.
X-FAB other nodes
0.11μm at other foundries
CROSS-FOUNDRY COMPARISON
Compare 0.11μm across foundries
Compare 9 listed foundry profiles for 0.11μm, including X-FAB. Use the node comparison tool to review process and MPW planning context; public-reference profiles require separate confirmation of project access and current run options.