MPW / Shuttle access
X-FAB 0.11μm MPW
Plan a 0.11μm multi-project wafer run at X-FAB through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.
Why 0.11μm
0.11μm is one of the process options TOMPW coordinates as a shared-mask MPW run at the partner foundry. We handle slot selection, EDA checks and logistics so your design reaches the line on schedule.
What a 0.11μm MPW at X-FAB involves
A 0.11μm MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches X-FAB's line on schedule.
Step 1
GDSII & spec
Share your GDSII, target node and tape-out window.
Step 2
Slot & mask share
TOMPW books the next shuttle and aligns mask share.
Step 3
Wafer, package, test
Wafers returned, then package/test aligned as needed.
Technologies & platforms at 0.11μm
Notes for 0.11μm programs
- X-FAB is a leading specialty analog and mixed-signal foundry.
- TOMPW can support automotive qualification and MEMS-specific packaging.
Best-fit applications
Expert reviewed
This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.
Discuss a 0.11μm MPW at X-FAB
TOMPW Service can coordinate a 0.11μm MPW shuttle with X-FAB as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with X-FAB 0.11μm MPW through TOMPW
Can TOMPW arrange a 0.11μm MPW shuttle at X-FAB?
Yes. TOMPW coordinates 0.11μm MPW and shuttle access at X-FAB for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.
What does a 0.11μm MPW run at X-FAB typically include?
A 0.11μm MPW run bundles your design onto a shared reticle with other projects, covering mask share, wafer fabrication at X-FAB, and standard probe. Packaging, final test and NTO transition are planned separately with TOMPW.
How long does a 0.11μm MPW cycle take at X-FAB?
Cycle time depends on X-FAB's shuttle cadence for 0.11μm, usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.
What comes after a 0.11μm MPW at X-FAB?
After a successful 0.11μm MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through X-FAB and downstream partners.
PLAN & ESTIMATE
Calculators for your 0.11μm MPW
Estimate dies per wafer, split shared-mask cost and model unit economics before you commit to a shuttle slot.
Die Per Wafer Calculator
Estimate gross and net dies per wafer from wafer size, die dimensions, scribe lanes, edge exclusion and yield models.
Open tool →MPW Cost Sharing Calculator
Split a shared MPW wafer cost across multiple designs by occupied wafer area — per-participant share and cost.
Open tool →Wafer & Unit Cost Calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open tool →Tape-out Budget Estimator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open tool →RELATED FOUNDRY PROFILES
Other foundries teams compare X-FAB with
RELATED SERVICES
Services that pair with a X-FAB 0.11μm MPW
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Plan package type, prototype assembly, inspection and qualification early so silicon delivery does not stall after wafer completion.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →RELATED MPW NODES
Other 0.11μm and X-FAB MPW access pages
Browse adjacent shuttle nodes so comparison and scheduling research stays on one program path.
X-FAB other nodes
0.11μm at other foundries
CROSS-FOUNDRY COMPARISON
Compare 0.11μm across foundries
0.11μm MPW is offered by 9 TOMPW-supported foundries including X-FAB. Use the node comparison tool to see per-foundry shuttle cadence, MPW cost-sharing and ecosystem notes side by side.