Free planning tool
Tape-out Budget Estimator
A consolidated cost model for an ASIC program — from dies per wafer and yield through packaging, HBM, test and one-time NRE, down to unit cost, price and program gross margin. Built for early business cases and customer pitches.
Process node
Yield model
Estimated unit cost
$16.88
Price @ 45% margin: $24.48
Gross DPW
633
Net die
520
Yield
82.1%
Wafer $/die
$15.38
Pkg $/die
$1.00
HBM $/die
$0.00
Test $/die
$0.50
Unit cost
$16.88
Program economics
Program cost
$2,188,462
Revenue
$2,448,269
Gross margin
$259,808
10.6%
Illustrative only. NRE/mask, HBM and packaging costs vary widely by supplier and volume — use as a sanity check, then confirm with foundry and OSAT quotes.
Export
What feeds the model
- Unit cost = wafer $/die (wafer cost ÷ net die) + packaging + HBM + test.
- Program cost = NRE + volume × unit cost; revenue = volume × price.
- Margins improve sharply once volume amortizes NRE — the classic tape-out economics story.
Need a defensible quote for a real program? Talk to our team for foundry- and OSAT-verified numbers.