Free planning tool
Tape-out Budget Estimator
A consolidated cost model for an ASIC program — from dies per wafer and yield through packaging, HBM, test and one-time NRE, down to unit cost, price and program gross margin. Built for early business cases and customer pitches.
Estimated unit cost
$16.88
Price @ 45% margin: $24.48
Gross DPW
633
Net die
520
Yield
82.1%
Wafer $/die
$15.38
Pkg $/die
$1.00
HBM $/die
$0.00
Test $/die
$0.50
Unit cost
$16.88
Program economics
Program cost
$2,188,462
Revenue
$2,448,269
Gross margin
$259,808
10.6%
Illustrative only. NRE/mask, HBM and packaging costs vary widely by supplier and volume — use as a sanity check, then confirm against a scoped TOMPW quote.
Disclaimer: This tool and its outputs are for reference and preliminary evaluation only, not design, manufacturing, qualification or commercial approval; verify all results with the responsible supplier or engineer.
What feeds the model
- Unit cost = wafer $/die (wafer cost ÷ net die) + packaging + HBM + test.
- Program cost = NRE + volume × unit cost; revenue = volume × price.
- Margins improve sharply once volume amortizes NRE — the classic tape-out economics story.
Need a defensible quote for a real program? Talk to our team for foundry- and OSAT-verified numbers.
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Foundries TOMPW coordinates
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Related execution paths
These are industry reference ranges, not a quotation and not an offer.
- Every band on this page is deliberately wide. It is published so you can sanity-check whether a programme is realistic before you write to anyone — not so you can budget against it.
- Actual pricing moves with the season and with capacity. Foundry and OSAT utilisation changes month to month, and a window that is cheap in a soft quarter can be materially more expensive in a tight one.
- Mask, substrate, leadframe, gold, copper and tester-time costs all move independently of the node you chose.