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Foundry profile

HHGrace

HHGrace (Huahong Grace) is a specialized foundry for embedded memory, BCD and power management platforms. TOMPW Service supports HHGrace programs for automotive and industrial applications.

Reviewed July 8, 2026Scope: MPW, NTO and production evaluation
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HHGrace — representative silicon and device imagery from programs we support

Representative imagery from semiconductor programs we have supported or analysed

Process Nodes

0.11μm0.13μm0.15μm0.18μm0.25μm0.35μm0.5μm0.7μm1.0μm

Technologies & Platforms

BCD
eFlash
eEEPROM
HV CMOS
CMOS

TOMPW Support Capabilities

✓Embedded memory platform support
✓BCD for power management
✓Automotive-grade process qualification
✓High-voltage IC process

Best For

Embedded memory programsPower management and BCD applicationsAutomotive and industrial ICsSmartcard and security ICs

Notes

  • HHGrace is a leading specialty foundry for embedded memory and BCD.
  • TOMPW can support automotive qualification requirements.

Why This Profile Exists

This profile exists so a team can review foundry-specific context directly, while still understanding TOMPW's role in execution, comparison and downstream supply-chain coordination.

Discuss HHGrace for Your Program

TOMPW Service can coordinate MPW, NTO and production engagements with HHGrace as part of a scoped execution path.

Email for a Quote

COMMON QUESTIONS

Working with HHGrace through TOMPW

Can TOMPW arrange MPW or shuttle runs at HHGrace?

Yes. TOMPW coordinates MPW, NTO and full-mask access at HHGrace for overseas chip teams, handling scheduling, EDA checks and logistics.

What support does TOMPW provide beyond the wafer at HHGrace?

Packaging, final test, PCB support and turnkey assembly coordination through the foundries we coordinate, so the customer sees a simpler handoff path.

How do I get a quote for a HHGrace engagement?

Email market@tompwservice.com with your GDSII, target node and volume, or use the quote button. TOMPW returns a scoped execution plan.

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RELATED SERVICES

Services that pair with a HHGrace engagement

MPW / Fab Shuttle

Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.

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Full Mask / Production Foundry

Move validated designs into dedicated mask production with yield, volume and supply planning support.

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Semiconductor Packaging

Plan package type, prototype assembly, inspection and qualification early so silicon delivery does not stall after wafer completion.

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Test & Product Engineering

Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.

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Turnkey ASIC Solutions

Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.

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