Free planning tool
Die Per Wafer Calculator
Build a Shot/Field exposure layout and count the complete dies that fit within your wafer boundary. Set the die array, stepping, offset, flat or notch and edge clearance. The map and geometric Net Die use the same placements; an optional yield model estimates good dies separately.
Optional: defect-adjusted yield
Set defect density to 0 to turn this estimate off. Yield affects estimated good dies only; it never changes the layout or geometric count.
Geometric dies per wafer
616
Complete dies counted individually in this placement.
Counted die area*
87.1%
Excluded dies
124
Estimated good dies
506
*Die area divided by nominal circular wafer area. Optional murphy yield: 82.15%.
Field: 2 columns × 2 rows · Die pitch: 10.1 × 10.1 mm
Shot: 20.2 × 20.2 mm · Step: 20.2 × 20.2 mm
Shots intersecting circular blank: 201 · with counted dies: 177
Counted wafer layout
Every blue rectangle is one counted die. Excluded dies are clipped at the physical wafer outline. X points right; Y points up.
Planning scope. This is a geometric count for the entered grid and simplified boundary shape. It does not optimize offsets, model foundry process restrictions or determine MPW allocation. Confirm the final exposure map and deliverable quantity with the provider.
JSON includes every die coordinate, status and shot. The summary contains totals.
Disclaimer: This tool and its outputs are for reference and preliminary evaluation only, not design, manufacturing, qualification or commercial approval; verify all results with the responsible supplier or engineer.
Shot and field rules
- Die pitch is die width plus scribe X, and die height plus scribe Y. A 90° rotation swaps both die dimensions and scribe X / Y, rotating the whole pitch cell. Field columns and rows still follow the wafer X and Y axes.
- Field array is the number of die columns and rows in one shot. Columns × pitch X must fit within shot width, and rows × pitch Y within shot height. The pitch-cell array is centered in the shot.
- Step pitch is the distance between neighboring shot centers. Each step must be at least its shot dimension, so shots do not overlap.
- Offset X / Y places the reference shot center relative to the wafer center. Other shot centers repeat by the chosen step pitch. Changing the offset can change the count.
Boundary and count rules
- Circle: every corner of a complete die must fit inside the circle after edge exclusion.
- Flat: the die must also stay on the retained side of the flat cut line, with the same edge clearance.
- V-notch: the whole die rectangle must avoid the notch, including clearance from its edges. Checking only die corners would miss a notch crossing through a die edge.
- Partial shots: when enabled, complete dies in a shot that crosses the usable wafer boundary can still count. When disabled, the whole shot must fit within that boundary.
Geometry, yield and program planning
Geometric Net Die is the count of complete dies accepted by the specified layout and boundary rules. Optional Murphy or Poisson models apply defect density to that count to estimate good dies. They do not replace electrical testing or determine delivered quantities.
Flat and notch dimensions describe the geometry you enter; they are not a SEMI specification or a foundry-qualified wafer profile. The calculator evaluates the layout you choose and does not search for a globally optimal arrangement. Confirm the exposure recipe, keep-outs and final count with your foundry.
MPW / shuttle quotes depend on booked blocks and provider terms. Use the MPW cost sharing tool to allocate an agreed shared cost by booked area.
Need an official DPW for a real run? Check MPW shuttle coverage or request a quote to confirm the geometry and delivery terms for your program.
FOUNDRY NETWORK
Foundries TOMPW coordinates
SERVICES & SCHEDULE
Related execution paths
These are industry reference ranges, not a quotation and not an offer.
- Every band on this page is deliberately wide. It is published so you can sanity-check whether a programme is realistic before you write to anyone — not so you can budget against it.
- Actual pricing moves with the season and with capacity. Foundry and OSAT utilisation changes month to month, and a window that is cheap in a soft quarter can be materially more expensive in a tight one.
- Mask, substrate, leadframe, gold, copper and tester-time costs all move independently of the node you chose.