Free planning tool
Die Per Wafer Calculator
Estimate how many dies (chips) fit on a single wafer for cost, yield and tape-out planning. Adjust wafer size, die dimensions, scribe lanes and edge exclusion, then optionally apply a defect-density yield model to see net good dies.
Murphy model fits large dies (>1 cm²) better; Poisson is simpler. Set defect density to 0 to hide net-die estimates.
Gross dies per wafer
633
Area-only max
692
Utilization
89.6%
Net good die
520
Yield ≈ 82.1% · Net = gross × yield
Wafer die layout (visual estimate)
Blue = fully usable dies · Light blue = partial edge dies
Why it matters
- Cost per chip is driven by how many dies fit on a wafer — small die-size changes swing unit economics.
- Yield planning needs both gross and net die counts before committing to a node or wafer run.
- MPW / shuttle quotes start from DPW to split mask and wafer cost across participants.
The formula
Gross dies use the standard area-minus-edge-loss approximation:
DPW ≈ π·(R − we)² / pitchArea
− π·(R − we) / √(2 · pitchArea)
pitchArea = (dieW + scribeX)·(dieH + scribeY)
R = wafer diameter / 2, we = edge exclusionNet good dies apply a yield model (Murphy or Poisson) on defect density. Treat results as an estimate — always confirm final DPW with your foundry.
Need an official DPW for a real run? Check MPW shuttle coverage or request a quote and our team will get you foundry-verified numbers.