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Free planning tool

Wafer & Unit Cost Calculator

Turn a wafer run into a per-chip cost. Combine dies-per-wafer and yield with packaging and test cost to get an estimated unit cost, then apply a target margin for a suggested price — useful for early ASIC budgeting and quotes.

Yield model

Estimated unit cost

$23.88

Suggested price @ 40% margin: $33.43

Gross DPW

633

Net die

520

Yield

82.1%

Utilization

89.6%

Wafer $/die

$23.08

Packaging

$0.50

Test

$0.30

Unit cost

$23.88

Unit cost = wafer cost ÷ net die + packaging + test. Price applies the target margin as markup. Wafer and packaging/test costs are illustrative — confirm against a scoped TOMPW quote before you commit.

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Disclaimer: This tool and its outputs are for reference and preliminary evaluation only, not design, manufacturing, qualification or commercial approval; verify all results with the responsible supplier or engineer.

COST ANATOMY

Where the unit cost actually lands

Most early budgets forget packaging and test. This illustrative split shows why wafer $/die is only part of the story — and why the calculator below matters for a real quote.

Swipe horizontally to read the full chart.

Where the unit cost goesIllustrative ASIC at ~$4.20 unit costUnitcostWafer $/die56% · $2.35Packaging22% · $0.92Test14% · $0.59Margin / buffer8% · $0.34
Wafer $/die is usually the largest slice; packaging and test scale with pin count and complexity. Model your own with the calculator.

The cost stack

  • Wafer $/die = wafer cost ÷ net good dies (gross DPW × yield).
  • Unit cost = wafer $/die + packaging + test.
  • Price = unit cost × (1 + target margin).

Want foundry-verified cost for a real program? Request a quote and our team will model it against current wafer and OSAT pricing.

These are industry reference ranges, not a quotation and not an offer.

  • Every band on this page is deliberately wide. It is published so you can sanity-check whether a programme is realistic before you write to anyone — not so you can budget against it.
  • Actual pricing moves with the season and with capacity. Foundry and OSAT utilisation changes month to month, and a window that is cheap in a soft quarter can be materially more expensive in a tight one.
  • Mask, substrate, leadframe, gold, copper and tester-time costs all move independently of the node you chose.