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Node / Wafer DPW Comparison

Lock your die size and compare how many dies fit — and what each die costs — across wafer sizes. A quick way to reason about 200 mm vs 300 mm and find the sweet spot for your volume and budget.

Yield model
Wafer sizes to compare
200 mm (8")268 dies
300 mm (12")633 dies
WaferDPWUtil.Wafer $$/die
200 mm (8")26885.3%$13.060
300 mm (12")63389.6%$18.957

Larger wafers fit far more dies, but cost more — the $/die column shows the trade-off for your specific die. Edit wafer cost per size to model your quoted prices.

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WHY WAFER SIZE MATTERS

The 8-inch vs 12-inch effect

For the same die, moving to a larger wafer roughly doubles usable area. The calculator below turns that into exact DPW and $/die for your dimensions.

8-inch vs 12-inch: dies per waferIllustrative, fixed 8 × 8 mm die (gross, edge exclusion applied)200 mm8-inch430 dies300 mm12-inch960 diesDies per wafer (same die)430960
Larger wafers roughly double usable area, so $/die can drop 30–40% at volume — but wafer cost rises too. Compare on the calculator for your exact die.

What to watch

  • Moving from 200 mm to 300 mm roughly doubles usable area, but wafer cost rises too — compare $/die, not just DPW.
  • Small dies gain the most from larger wafers; very large dies are edge-limited either way.
  • For MPW/shuttle, the right wafer size is also driven by which shuttles your target foundry actually runs.

See which foundries run which shuttles on the MPW schedule page.