REFERENCE TABLE
IC Package Type Comparison
A static, quotable comparison of the six package families most ASIC and MPW teams choose between. Use it as a first-pass filter, then confirm with the Package Selection Advisor and your OSAT.
| Package | IO range | Min pitch | Thermal | RF | Cost | Typical applications |
|---|---|---|---|---|---|---|
| QFNQuad Flat No-lead | 8 – 100 | 0.4 – 0.65 mm | Good (exposed pad) | Good (short bonds) | Low | Analog, RF, mixed-signal, power |
| BGABall Grid Array | 40 – 1,500+ | 0.4 – 1.0 mm | Very good (thermal balls) | Good (short traces) | Medium | High-IO ASIC, large die, GPU/SoC |
| WLCSPWafer-Level CSP | 4 – 200 | 0.35 – 0.5 mm | Limited (no substrate) | Excellent (no wirebond) | Low–Medium | Wearables, sensors, miniaturized devices |
| Flip-ChipFlip-Chip (C4 / bump) | 20 – 2,000+ | 0.1 – 0.4 mm | Excellent (direct attach) | Excellent (no wirebond) | Medium–High | High-speed, high-power, advanced-node die |
| SiPSystem-in-Package | 20 – 1,000+ | 0.4 – 1.0 mm | Variable | Good | High | Heterogeneous systems, ASIC + memory + passives |
| SOIC / TSSOPLeaded legacy | 8 – 56 | 0.65 – 1.27 mm | Poor | Poor (long bonds) | Very low | Prototyping, low-frequency, easy assembly |
Ranges are typical production envelopes, not hard limits. Exact IO and pitch depend on the specific substrate and OSAT process. Figures are illustrative for early planning.
FREQUENTLY ASKED
Package selection questions
Which package is cheapest?
Leaded SOIC/TSSOP and QFN are the lowest-cost options. QFN gives better thermal and RF than SOIC at a small cost premium, which is why it is the default for most modern analog and mixed-signal devices.
Which package is best for RF?
WLCSP and Flip-Chip avoid wirebond inductance and are strongest for RF and high-frequency designs. QFN works at moderate frequencies with careful grounding; leaded packages do not.
When should I choose SiP over a single package?
SiP pays off when you must integrate multiple dies — an ASIC plus memory or passives — into one component. A single die is better served by QFN, BGA or WLCSP.
How do I pick quickly?
Filter by IO count first, then apply power and RF constraints, then break ties on cost and form factor. The Package Selection Advisor ranks all six families against your numbers.