OSAT handoff / free preflight tool

Packaging Input Checker & Bond Sketch

Check pad-to-pin mapping and orientation, compare packaging revisions and overlay 2D bond sketches before an OSAT handoff.

What to provide

A JSON manifest with die dimensions, pad and package-pin coordinates, bonds, orientation, pin 1 and RFQ fields. Pins use the package frame.

What you get

Mapping issues, missing RFQ fields, explicit revision changes and a baseline/candidate overlay when blocking inputs are resolved.

Local processing. These checks do not send input files, pasted content or reports to a TOMPW server, AI model or cloud parser. Input is held in page memory only. The website still has its usual page analytics. For fully offline or highly sensitive work, use the local source package.

Packaging JSON manifest

{
  "unit": "mm",
  "origin": "center",
  "view": "top",
  "rotation": 0,
  "mirrorX": false,
  "die": {
    "width": 2,
    "height": 2
  },
  "pads": [
    {
      "id": "A",
      "x": -0.8,
      "y": 0.5,
      "net": "VDD",
      "disposition": "bond"
    },
    {
      "id": "B",
      "x": 0.8,
      "y": 0.5,
      "net": "GND",
      "disposition": "bond"
    },
    {
      "id": "C",
      "x": 0.8,
      "y": -0.5,
      "net": "IO",
      "disposition": "bond"
    },
    {
      "id": "D",
      "x": -0.8,
      "y": -0.5,
      "net": "NC",
      "disposition": "no-connect"
    }
  ],
  "pins": [
    {
      "id": "1",
      "x": -2,
      "y": 0.5,
      "net": "VDD",
      "allowMultiplePads": false
    },
    {
      "id": "2",
      "x": 2,
      "y": 0.5,
      "net": "GND",
      "allowMultiplePads": false
    },
    {
      "id": "3",
      "x": 2,
      "y": -0.5,
      "net": "IO",
      "allowMultiplePads": false
    }
  ],
  "bonds": [
    {
      "pad": "A",
      "pin": "1"
    },
    {
      "pad": "B",
      "pin": "2"
    },
    {
      "pad": "C",
      "pin": "3"
    }
  ],
  "pin1": "1",
  "rfq": {
    "packageType": "Synthetic QFN demo",
    "temperatureGrade": "To be confirmed with OSAT",
    "quantity": 100,
    "wireMaterial": "Au (demo assumption)",
    "padMetallurgy": "Al (demo assumption)",
    "dieThickness": 0.2,
    "revision": "SYNTHETIC-1"
  }
}

Die pads: stated origin, mirror, CCW rotation, then top/bottom view. Package pins: already in the package frame (+X right, +Y up). Multiple pads to one pin require explicit permission. A crossing in the sketch is a review flag, not proof of a 3D collision.

Compare packaging revisions

The main manifest is the candidate. Add an earlier revision below. Stable pad/pin IDs are required; renames are not inferred. Dashed blue is baseline, solid orange is candidate, in one package coordinate frame.

Baseline packaging JSON

No current result. Review inputs, then run the check. Editing an input clears the previous report.

Disclaimer: This tool and its outputs are for reference and preliminary evaluation only, not design, manufacturing, qualification or commercial approval; verify all results with the responsible supplier or engineer.

Download offline source package 1.1.0 (ZIP)Review source, tests and licenses on GitHub

Original MIT-licensed models, Node CLI, synthetic tests and optional Python readers. No customer files or dependency environment is included. Read the bundled README and third-party notices before use or redistribution.

Source archive SHA256

Before using this in a handoff

The sketch does not verify loop height, wire clearance, DRC, current capacity, RF performance or OSAT approval.

All built-in examples are synthetic, not product data, customer evidence or supplier commitments. Retain the input revision and review the downloaded report with the responsible provider.

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