MPW / Shuttle access
IHP 130nm MPW
Plan a 130nm multi-project wafer run at IHP through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.
Why 130nm
130nm is a low-cost node with strong analog, BCD and RF capabilities. TOMPW coordinates 130nm MPW shuttles for power and mixed-signal designs.
Typical applications
- ✓Power management (BCD)
- ✓Analog and mixed-signal
- ✓RF and sensor ICs
- ✓Automotive and industrial
What a 130nm MPW at IHP involves
A 130nm MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches IHP's line on schedule.
Step 1
GDSII & spec
Share your GDSII, target node and tape-out window.
Step 2
Slot & mask share
TOMPW books the next shuttle and aligns mask share.
Step 3
Wafer, package, test
Wafers returned, then package/test aligned as needed.
Platforms across IHP
Foundry-level platforms, not a list of everything 130nm offers. Which of these apply to your 130nm run is confirmed per project.
Notes on working with IHP
- IHP is a premier SiGe BiCMOS and photonics research foundry.
- TOMPW can coordinate MPW shuttle access and downstream packaging for IHP designs.
Best-fit applications
Expert reviewed
This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.
Discuss a 130nm MPW at IHP
TOMPW Service can coordinate a 130nm MPW shuttle with IHP as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with IHP 130nm MPW through TOMPW
Can TOMPW arrange a 130nm MPW shuttle at IHP?
Yes. TOMPW coordinates 130nm MPW and shuttle access at IHP for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.
What does a 130nm MPW run at IHP typically include?
A 130nm MPW run bundles your design onto a shared reticle with other projects, covering mask share and wafer fabrication at IHP. Wafer-level probe is included only on the shuttles that offer it, so we confirm probe coverage for the specific run before you commit. Packaging, final test and the NTO transition are scoped separately with TOMPW.
How long does a 130nm MPW cycle take at IHP?
Cycle time depends on IHP's shuttle cadence for 130nm, usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.
What comes after a 130nm MPW at IHP?
After a successful 130nm MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through IHP and downstream partners.
PLAN & ESTIMATE
Calculators for your 130nm MPW
Estimate dies per wafer, split shared-mask cost and model unit economics before you commit to a shuttle slot.
Die Per Wafer Calculator
Count complete dies from Shot/Field layouts with flat or notched wafer boundaries, edge clearance and optional yield estimates.
Open tool →MPW Cost Sharing Calculator
Allocate an agreed MPW shared cost by booked block area and block count, without predicting delivered dies.
Open tool →Wafer & Unit Cost Calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open tool →Tape-out Budget Estimator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open tool →RELATED FOUNDRY PROFILES
Other foundries teams compare IHP with
RELATED SERVICES
Services that pair with a IHP 130nm MPW
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Semiconductor packaging through external assembly and test providers, with TOMPW coordinating package selection, supplier review and assembly-to-test handoff.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →RELATED MPW NODES
Other 130nm and IHP MPW access pages
Browse adjacent shuttle nodes so comparison and scheduling research stays on one program path.
130nm at other foundries
CROSS-FOUNDRY COMPARISON
Compare 130nm across foundries
130nm MPW is offered by 2 TOMPW-supported foundries including IHP. Use the node comparison tool to see per-foundry shuttle cadence, MPW cost-sharing and ecosystem notes side by side.