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IHPFoundry profile · process nodes · MPW shuttle windows · tape-out access

IHP (Leibniz-Institut für innovative Mikroelektronik) is a leading research foundry for SiGe BiCMOS and photonic integrated circuits. TOMPW Service supports IHP MPW and multi-project shuttle access for RF, mmWave and photonics programs.

Reviewed October 29, 20264 process nodes listed: 0.13μm SiGe BiCMOS, 0.25μm SiGe BiCMOS, 130nm and moreScope: MPW, NTO and production evaluation
IHP — representative silicon and device imagery from programs we support

Representative imagery from semiconductor programs we have supported or analysed

Process Nodes

0.13μm SiGe BiCMOS0.25μm SiGe BiCMOS130nm250nm

Technologies & Platforms

SiGe BiCMOS
RF CMOS
Photonic IC (PIC)
BiCMOS
SG13 / SG25 platforms

TOMPW Support Capabilities

✓MPW shuttle for IHP SG13 / SG25 platforms
✓SiGe BiCMOS RF and mmWave support
✓Photonic integrated circuit shuttles
✓Research and prototype silicon coordination

Best For

RF and mmWave ICs5G and radar front-endsPhotonic and optical enginesResearch and prototype programs

Notes

  • IHP is a premier SiGe BiCMOS and photonics research foundry.
  • TOMPW can coordinate MPW shuttle access and downstream packaging for IHP designs.

Plan the manufacturing route

Compare the process requirements with the package and test path before selecting a manufacturing route. Confirm the PDK, supplier acceptance, commercial terms and delivery scope in the project proposal.

Discuss IHP for Your Program

Share the application, process requirements and target quantities. TOMPW will review feasibility and identify the access, package and test conditions to confirm for IHP.

Email for a Quote

COMMON QUESTIONS

Planning a IHP project

Can TOMPW arrange MPW or shuttle runs at IHP?

TOMPW reviews MPW, NTO and full-mask options for IHP projects. Process acceptance, PDK access, run availability, quantities and delivery dates are confirmed for the specific project before booking.

What support does TOMPW provide beyond the wafer at IHP?

TOMPW can scope packaging, final test, PCB and assembly work alongside the wafer requirements. The package route, responsible suppliers, test coverage and acceptance criteria are agreed in the project proposal.

How do I get a quote for a IHP engagement?

Email market@tompwservice.com with the application, target process, program stage, volume and package or test needs. Start with non-confidential requirements; design files can follow through an agreed secure handoff.

RELATED FOUNDRY PROFILES

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RELATED SERVICES

Services that pair with a IHP engagement

MPW / SHUTTLE ACCESS

Plan a IHP MPW by process node

TOMPW coordinates multi-project wafer runs at IHP across the nodes below. Open a node to see typical applications, what the run involves and how to book a shuttle slot.

MPW SHUTTLE PLAN

Shuttle windows at IHP by process node

The months below mark where a window commonly opens on each platform. A run launches once it fills, so read this as planning rhythm rather than a bookable date — send TOMPW your node and target quarter and we will tell you which run you can actually join.

SG13C SiGe:C RF CMOS

janfebmaraprmayjunjulaugsepoctnovdec

SG13G2 SiGe:C Bipolar/Analog

janfebmaraprmayjunjulaugsepoctnovdec

SG13G2Cu (FEOL process SG13G2 + Cu BEOL option from X-FAB)

janfebmaraprmayjunjulaugsepoctnovdec

SG13G3Cu (FEOL process + Cu BEOL option from X-FAB)

janfebmaraprmayjunjulaugsepoctnovdec

SG13G3 (FEOL process SG13G3Cu + Al-BEOL option)*

janfebmaraprmayjunjulaugsepoctnovdec

SG13S SiGe:C Bipolar/Analog

janfebmaraprmayjunjulaugsepoctnovdec

SG13SCu (FEOL process SG13S + Cu BEOL option from X-FAB)

janfebmaraprmayjunjulaugsepoctnovdec

MEMRES for SG13S

janfebmaraprmayjunjulaugsepoctnovdec

SG25 PIC (Photonics, Ge Photo-diode, BEOL)

janfebmaraprmayjunjulaugsepoctnovdec

SG25H5_EPIC high performance BiCMOS + Photonic

janfebmaraprmayjunjulaugsepoctnovdec

BEOL SG13 (M1 and Metal Layers Above) + optional LBE or TSV or RDL

janfebmaraprmayjunjulaugsepoctnovdec