
MPW / Shuttle access
WIN Semiconductors 0.10µm GaN HEMT MPW
Plan a 0.10µm GaN HEMT multi-project wafer run at WIN Semiconductors through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.
Why 0.10µm GaN HEMT
0.10µm GaN HEMT is one of the process options TOMPW coordinates as a shared-mask MPW run at the partner foundry. We handle slot selection, EDA checks and logistics so your design reaches the line on schedule.
What a 0.10µm GaN HEMT MPW at WIN Semiconductors involves
A 0.10µm GaN HEMT MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches WIN Semiconductors's line on schedule.

Step 1
GDSII & spec
Share your GDSII, target node and tape-out window.

Step 2
Slot & mask share
TOMPW books the next shuttle and aligns mask share.

Step 3
Wafer, package, test
Wafers returned, then package/test aligned as needed.
Platforms across WIN Semiconductors
Foundry-level platforms, not a list of everything 0.10µm GaN HEMT offers. Which of these apply to your 0.10µm GaN HEMT run is confirmed per project.
Notes on working with WIN Semiconductors
- WIN runs regular GaAs/GaN MPW shuttles (e.g. NP12, PIN, PP series) through the year.
- TOMPW can coordinate compound-semiconductor MPW and downstream test.
Best-fit applications
Expert reviewed
This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.
Discuss a 0.10µm GaN HEMT MPW at WIN Semiconductors
TOMPW Service can coordinate a 0.10µm GaN HEMT MPW shuttle with WIN Semiconductors as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with WIN Semiconductors 0.10µm GaN HEMT MPW through TOMPW
Can TOMPW arrange a 0.10µm GaN HEMT MPW shuttle at WIN Semiconductors?
Yes. TOMPW coordinates 0.10µm GaN HEMT MPW and shuttle access at WIN Semiconductors for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.
What does a 0.10µm GaN HEMT MPW run at WIN Semiconductors typically include?
A 0.10µm GaN HEMT MPW run bundles your design onto a shared reticle with other projects, covering mask share and wafer fabrication at WIN Semiconductors. Wafer-level probe is included only on the shuttles that offer it, so we confirm probe coverage for the specific run before you commit. Packaging, final test and the NTO transition are scoped separately with TOMPW.
How long does a 0.10µm GaN HEMT MPW cycle take at WIN Semiconductors?
Cycle time depends on WIN Semiconductors's shuttle cadence for 0.10µm GaN HEMT, usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.
What comes after a 0.10µm GaN HEMT MPW at WIN Semiconductors?
After a successful 0.10µm GaN HEMT MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through WIN Semiconductors and downstream partners.
PLAN & ESTIMATE
Calculators for your 0.10µm GaN HEMT MPW
Estimate dies per wafer, split shared-mask cost and model unit economics before you commit to a shuttle slot.
Die Per Wafer Calculator
Count complete dies from Shot/Field layouts with flat or notched wafer boundaries, edge clearance and optional yield estimates.
Open tool →MPW Cost Sharing Calculator
Allocate an agreed MPW shared cost by booked block area and block count, without predicting delivered dies.
Open tool →Wafer & Unit Cost Calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open tool →Tape-out Budget Estimator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open tool →RELATED FOUNDRY PROFILES
Other foundries teams compare WIN Semiconductors with
RELATED SERVICES
Services that pair with a WIN Semiconductors 0.10µm GaN HEMT MPW
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Semiconductor packaging through external assembly and test providers, with TOMPW coordinating package selection, supplier review and assembly-to-test handoff.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →RELATED MPW NODES
Other 0.10µm GaN HEMT and WIN Semiconductors MPW access pages
Browse adjacent shuttle nodes so comparison and scheduling research stays on one program path.