Foundry profile
Dynax
Dynax (Suzhou Nengxun Gaoneng Semiconductor) is a China-based GaN RF semiconductor manufacturer offering wafer foundry service on its 0.45 / 0.25 / 0.15 / 0.1 µm GaN HEMT platforms for wireless communications, radar and RF energy applications.
Representative imagery from semiconductor programs we have supported or analysed
Process Nodes
Technologies & Platforms
TOMPW Support Capabilities
Best For
Notes
- Dynax offers GaN wafer foundry for RF customers; TOMPW can help scope GaN programs.
- Process menu spans 0.45 µm to 0.1 µm GaN HEMT.
Why This Profile Exists
This profile exists so a team can review foundry-specific context directly, while still understanding TOMPW's role in execution, comparison and downstream supply-chain coordination.
Discuss Dynax for Your Program
TOMPW Service can coordinate MPW, NTO and production engagements with Dynax as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with Dynax through TOMPW
Can TOMPW arrange MPW or shuttle runs at Dynax?
Yes. TOMPW coordinates MPW, NTO and full-mask access at Dynax for overseas chip teams, handling scheduling, EDA checks and logistics.
What support does TOMPW provide beyond the wafer at Dynax?
Packaging, final test, PCB support and turnkey assembly coordination through the foundries we coordinate, so the customer sees a simpler handoff path.
How do I get a quote for a Dynax engagement?
Email market@tompwservice.com with your GDSII, target node and volume, or use the quote button. TOMPW returns a scoped execution plan.
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RELATED SERVICES
Services that pair with a Dynax engagement
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Plan package type, prototype assembly, inspection and qualification early so silicon delivery does not stall after wafer completion.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →