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Dynax (Suzhou Nengxun) GaN foundry logo

Foundry profile

DynaxFoundry profile · process nodes · MPW shuttle windows · tape-out access

Dynax (Suzhou Nengxun Gaoneng Semiconductor) is a China-based GaN RF semiconductor manufacturer offering wafer foundry service on its 0.45 / 0.25 / 0.15 / 0.1 µm GaN HEMT platforms for wireless communications, radar and RF energy applications.

Reviewed October 29, 20264 process nodes listed: GaN HEMT 0.45 µm, GaN HEMT 0.25 µm, GaN HEMT 0.15 µm and moreScope: MPW, NTO and production evaluation
Dynax — representative silicon and device imagery from programs we support

Representative imagery from semiconductor programs we have supported or analysed

Process Nodes

GaN HEMT 0.45 µmGaN HEMT 0.25 µmGaN HEMT 0.15 µmGaN HEMT 0.1 µm

Technologies & Platforms

GaN
GaN HEMT
RF power
III-V

TOMPW Support Capabilities

✓GaN RF wafer foundry
✓RF power device platforms (PA, LNA, switch)
✓MMIC design enablement (PDK)
✓RF power for comms and radar

Best For

RF power amplifiers5G base station and broadband commsRadar and RF energySatellite communications

Notes

  • Dynax offers GaN wafer foundry for RF customers; TOMPW can help scope GaN programs.
  • Process menu spans 0.45 µm to 0.1 µm GaN HEMT.

Plan the manufacturing route

Compare the process requirements with the package and test path before selecting a manufacturing route. Confirm the PDK, supplier acceptance, commercial terms and delivery scope in the project proposal.

Discuss Dynax for Your Program

Share the application, process requirements and target quantities. TOMPW will review feasibility and identify the access, package and test conditions to confirm for Dynax.

Email for a Quote

COMMON QUESTIONS

Planning a Dynax project

Can TOMPW arrange MPW or shuttle runs at Dynax?

TOMPW reviews MPW, NTO and full-mask options for Dynax projects. Process acceptance, PDK access, run availability, quantities and delivery dates are confirmed for the specific project before booking.

What support does TOMPW provide beyond the wafer at Dynax?

TOMPW can scope packaging, final test, PCB and assembly work alongside the wafer requirements. The package route, responsible suppliers, test coverage and acceptance criteria are agreed in the project proposal.

How do I get a quote for a Dynax engagement?

Email market@tompwservice.com with the application, target process, program stage, volume and package or test needs. Start with non-confidential requirements; design files can follow through an agreed secure handoff.

RELATED FOUNDRY PROFILES

Other foundries teams compare Dynax with

WIN Semiconductorsprofile →STMicroelectronicsprofile →TSMCprofile →UMCprofile →

RELATED SERVICES

Services that pair with a Dynax engagement

MPW / Fab Shuttle

Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.

Learn more →

Full Mask / Production Foundry

Move validated designs into dedicated mask production with yield, volume and supply planning support.

Learn more →

Semiconductor Packaging

Semiconductor packaging through external assembly and test providers, with TOMPW coordinating package selection, supplier review and assembly-to-test handoff.

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Test & Product Engineering

Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.

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Turnkey ASIC Solutions

Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.

Learn more →

MPW / SHUTTLE ACCESS

Plan a Dynax MPW by process node

TOMPW coordinates multi-project wafer runs at Dynax across the nodes below. Open a node to see typical applications, what the run involves and how to book a shuttle slot.

GaN HEMT 0.45 µm MPW →GaN HEMT 0.25 µm MPW →GaN HEMT 0.15 µm MPW →GaN HEMT 0.1 µm MPW →
View MPW shuttle schedule & foundry coverage→