MPW / Shuttle access

Dynax GaN HEMT 0.1 µm MPW

Plan a GaN HEMT 0.1 µm multi-project wafer run at Dynax through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.

Node: GaN HEMT 0.1 µmMPW, NTO and production evaluation

Why GaN HEMT 0.1 µm

GaN HEMT 0.1 µm is one of the process options TOMPW coordinates as a shared-mask MPW run at the partner foundry. We handle slot selection, EDA checks and logistics so your design reaches the line on schedule.

What a GaN HEMT 0.1 µm MPW at Dynax involves

A GaN HEMT 0.1 µm MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches Dynax's line on schedule.

Step 1
GDSII & spec
Share your GDSII, target node and tape-out window.
Step 2
Slot & mask share
TOMPW books the next shuttle and aligns mask share.
Step 3
Wafer, package, test
Wafers returned, then package/test aligned as needed.

✓GaN RF wafer foundry

✓RF power device platforms (PA, LNA, switch)

✓MMIC design enablement (PDK)

✓RF power for comms and radar

Platforms across Dynax

Foundry-level platforms, not a list of everything GaN HEMT 0.1 µm offers. Which of these apply to your GaN HEMT 0.1 µm run is confirmed per project.

GaN

GaN HEMT

RF power

III-V

Notes on working with Dynax

Dynax offers GaN wafer foundry for RF customers; TOMPW can help scope GaN programs.
Process menu spans 0.45 µm to 0.1 µm GaN HEMT.

Best-fit applications

RF power amplifiers5G base station and broadband commsRadar and RF energySatellite communications

Expert reviewed

This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.

Discuss a GaN HEMT 0.1 µm MPW at Dynax

TOMPW Service can coordinate a GaN HEMT 0.1 µm MPW shuttle with Dynax as part of a scoped execution path.

Email for a Quote

COMMON QUESTIONS

Working with Dynax GaN HEMT 0.1 µm MPW through TOMPW

Can TOMPW arrange a GaN HEMT 0.1 µm MPW shuttle at Dynax?

Yes. TOMPW coordinates GaN HEMT 0.1 µm MPW and shuttle access at Dynax for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.

What does a GaN HEMT 0.1 µm MPW run at Dynax typically include?

A GaN HEMT 0.1 µm MPW run bundles your design onto a shared reticle with other projects, covering mask share and wafer fabrication at Dynax. Wafer-level probe is included only on the shuttles that offer it, so we confirm probe coverage for the specific run before you commit. Packaging, final test and the NTO transition are scoped separately with TOMPW.

How long does a GaN HEMT 0.1 µm MPW cycle take at Dynax?

Cycle time depends on Dynax's shuttle cadence for GaN HEMT 0.1 µm, usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.

What comes after a GaN HEMT 0.1 µm MPW at Dynax?

After a successful GaN HEMT 0.1 µm MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through Dynax and downstream partners.

PLAN & ESTIMATE