Foundry profile
STMicroelectronics
STMicroelectronics is a leading European IDM offering premium foundry services across its broad specialty portfolio: BCD (invented by ST), SiGe BiCMOS (B55 / B55X on 300 mm wafers in Europe), FD-SOI, RF-SOI, silicon photonics, MEMS, and wide-bandgap SiC and GaN.
Representative imagery from semiconductor programs we have supported or analysed
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Technologies & Platforms
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Notes
- ST is an IDM with a premium-foundry engagement model; TOMPW can help qualify a ST technology for your program.
- ST invented BCD and leads SiGe BiCMOS on 300 mm wafers in Europe.
Why This Profile Exists
This profile exists so a team can review foundry-specific context directly, while still understanding TOMPW's role in execution, comparison and downstream supply-chain coordination.
Discuss STMicroelectronics for Your Program
TOMPW Service can coordinate MPW, NTO and production engagements with STMicroelectronics as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with STMicroelectronics through TOMPW
Can TOMPW arrange MPW or shuttle runs at STMicroelectronics?
Yes. TOMPW coordinates MPW, NTO and full-mask access at STMicroelectronics for overseas chip teams, handling scheduling, EDA checks and logistics.
What support does TOMPW provide beyond the wafer at STMicroelectronics?
Packaging, final test, PCB support and turnkey assembly coordination through the foundries we coordinate, so the customer sees a simpler handoff path.
How do I get a quote for a STMicroelectronics engagement?
Email market@tompwservice.com with your GDSII, target node and volume, or use the quote button. TOMPW returns a scoped execution plan.
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RELATED SERVICES
Services that pair with a STMicroelectronics engagement
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Plan package type, prototype assembly, inspection and qualification early so silicon delivery does not stall after wafer completion.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →