Foundry profile
STMicroelectronicsFoundry profile · process nodes · MPW shuttle windows · tape-out access
STMicroelectronics is a leading European IDM offering premium foundry services across its broad specialty portfolio: BCD (invented by ST), SiGe BiCMOS (B55 / B55X on 300 mm wafers in Europe), FD-SOI, RF-SOI, silicon photonics, MEMS, and wide-bandgap SiC and GaN.
Representative imagery from semiconductor programs we have supported or analysed
Process Nodes
Technologies & Platforms
TOMPW Support Capabilities
Best For
Notes
- ST is an IDM with a premium-foundry engagement model; TOMPW can help qualify a ST technology for your program.
- ST invented BCD and leads SiGe BiCMOS on 300 mm wafers in Europe.
Plan the manufacturing route
Compare the process requirements with the package and test path before selecting a manufacturing route. Confirm the PDK, supplier acceptance, commercial terms and delivery scope in the project proposal.
Discuss STMicroelectronics for Your Program
Share the application, process requirements and target quantities. TOMPW will review feasibility and identify the access, package and test conditions to confirm for STMicroelectronics.
Email for a QuoteCOMMON QUESTIONS
Planning a STMicroelectronics project
Can TOMPW arrange MPW or shuttle runs at STMicroelectronics?
TOMPW reviews MPW, NTO and full-mask options for STMicroelectronics projects. Process acceptance, PDK access, run availability, quantities and delivery dates are confirmed for the specific project before booking.
What support does TOMPW provide beyond the wafer at STMicroelectronics?
TOMPW can scope packaging, final test, PCB and assembly work alongside the wafer requirements. The package route, responsible suppliers, test coverage and acceptance criteria are agreed in the project proposal.
How do I get a quote for a STMicroelectronics engagement?
Email market@tompwservice.com with the application, target process, program stage, volume and package or test needs. Start with non-confidential requirements; design files can follow through an agreed secure handoff.
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RELATED SERVICES
Services that pair with a STMicroelectronics engagement
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Semiconductor packaging through external assembly and test providers, with TOMPW coordinating package selection, supplier review and assembly-to-test handoff.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →MPW / SHUTTLE ACCESS
Plan a STMicroelectronics MPW by process node
TOMPW coordinates multi-project wafer runs at STMicroelectronics across the nodes below. Open a node to see typical applications, what the run involves and how to book a shuttle slot.