MPW / Shuttle access
STMicroelectronics SiGe BiCMOS (B55 / B55X, 300 mm) MPW
Plan a SiGe BiCMOS (B55 / B55X, 300 mm) multi-project wafer run at STMicroelectronics through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.
Why SiGe BiCMOS (B55 / B55X, 300 mm)
SiGe BiCMOS adds high-speed bipolar transistors to CMOS for RF, mmWave and photonics. TOMPW coordinates SiGe BiCMOS MPW shuttles (e.g. IHP SG13/SG25) for research and production prototypes.
Typical applications
- ✓5G and radar front-ends
- ✓mmWave and RF ICs
- ✓Photonic integrated circuits
- ✓Test and measurement
What a SiGe BiCMOS (B55 / B55X, 300 mm) MPW at STMicroelectronics involves
A SiGe BiCMOS (B55 / B55X, 300 mm) MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches STMicroelectronics's line on schedule.
Step 1
GDSII & spec
Share your GDSII, target node and tape-out window.
Step 2
Slot & mask share
TOMPW books the next shuttle and aligns mask share.
Step 3
Wafer, package, test
Wafers returned, then package/test aligned as needed.
Technologies & platforms at SiGe BiCMOS (B55 / B55X, 300 mm)
Notes for SiGe BiCMOS (B55 / B55X, 300 mm) programs
- ST is an IDM with a premium-foundry engagement model; TOMPW can help qualify a ST technology for your program.
- ST invented BCD and leads SiGe BiCMOS on 300 mm wafers in Europe.
Best-fit applications
Expert reviewed
This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.
Discuss a SiGe BiCMOS (B55 / B55X, 300 mm) MPW at STMicroelectronics
TOMPW Service can coordinate a SiGe BiCMOS (B55 / B55X, 300 mm) MPW shuttle with STMicroelectronics as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with STMicroelectronics SiGe BiCMOS (B55 / B55X, 300 mm) MPW through TOMPW
Can TOMPW arrange a SiGe BiCMOS (B55 / B55X, 300 mm) MPW shuttle at STMicroelectronics?
Yes. TOMPW coordinates SiGe BiCMOS (B55 / B55X, 300 mm) MPW and shuttle access at STMicroelectronics for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.
What does a SiGe BiCMOS (B55 / B55X, 300 mm) MPW run at STMicroelectronics typically include?
A SiGe BiCMOS (B55 / B55X, 300 mm) MPW run bundles your design onto a shared reticle with other projects, covering mask share, wafer fabrication at STMicroelectronics, and standard probe. Packaging, final test and NTO transition are planned separately with TOMPW.
How long does a SiGe BiCMOS (B55 / B55X, 300 mm) MPW cycle take at STMicroelectronics?
Cycle time depends on STMicroelectronics's shuttle cadence for SiGe BiCMOS (B55 / B55X, 300 mm), usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.
What comes after a SiGe BiCMOS (B55 / B55X, 300 mm) MPW at STMicroelectronics?
After a successful SiGe BiCMOS (B55 / B55X, 300 mm) MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through STMicroelectronics and downstream partners.
PLAN & ESTIMATE
Calculators for your SiGe BiCMOS (B55 / B55X, 300 mm) MPW
Estimate dies per wafer, split shared-mask cost and model unit economics before you commit to a shuttle slot.
Die Per Wafer Calculator
Estimate gross and net dies per wafer from wafer size, die dimensions, scribe lanes, edge exclusion and yield models.
Open tool →MPW Cost Sharing Calculator
Split a shared MPW wafer cost across multiple designs by occupied wafer area — per-participant share and cost.
Open tool →Wafer & Unit Cost Calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open tool →Tape-out Budget Estimator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open tool →RELATED FOUNDRY PROFILES
Other foundries teams compare STMicroelectronics with
RELATED SERVICES
Services that pair with a STMicroelectronics SiGe BiCMOS (B55 / B55X, 300 mm) MPW
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Plan package type, prototype assembly, inspection and qualification early so silicon delivery does not stall after wafer completion.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →RELATED MPW NODES
Other SiGe BiCMOS (B55 / B55X, 300 mm) and STMicroelectronics MPW access pages
Browse adjacent shuttle nodes so comparison and scheduling research stays on one program path.