MPW / Shuttle access

STMicroelectronics SiGe BiCMOS (B55 / B55X, 300 mm) MPW

Plan a SiGe BiCMOS (B55 / B55X, 300 mm) multi-project wafer run at STMicroelectronics through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.

Node: SiGe BiCMOS (B55 / B55X, 300 mm)MPW, NTO and production evaluation

Why SiGe BiCMOS (B55 / B55X, 300 mm)

SiGe BiCMOS adds high-speed bipolar transistors to CMOS for RF, mmWave and photonics. TOMPW coordinates SiGe BiCMOS MPW shuttles (e.g. IHP SG13/SG25) for research and production prototypes.

Typical applications

✓5G and radar front-ends
✓mmWave and RF ICs
✓Photonic integrated circuits
✓Test and measurement

What a SiGe BiCMOS (B55 / B55X, 300 mm) MPW at STMicroelectronics involves

A SiGe BiCMOS (B55 / B55X, 300 mm) MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches STMicroelectronics's line on schedule.

✓Premium foundry / technology licensing

✓Smart-power BCD platforms

✓RF and mmWave BiCMOS

✓MEMS sensing and actuation

✓Wide-bandgap SiC and GaN

Technologies & platforms at SiGe BiCMOS (B55 / B55X, 300 mm)

BCD

SiGe BiCMOS

FD-SOI

RF-SOI

MEMS

SiC

GaN

Silicon Photonics

Notes for SiGe BiCMOS (B55 / B55X, 300 mm) programs

ST is an IDM with a premium-foundry engagement model; TOMPW can help qualify a ST technology for your program.
ST invented BCD and leads SiGe BiCMOS on 300 mm wafers in Europe.

Best-fit applications

Smart-power and analog ICsRF / mmWave and optical interconnectsMEMS sensors and actuatorsAutomotive, industrial and power

Expert reviewed

This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.

Discuss a SiGe BiCMOS (B55 / B55X, 300 mm) MPW at STMicroelectronics

TOMPW Service can coordinate a SiGe BiCMOS (B55 / B55X, 300 mm) MPW shuttle with STMicroelectronics as part of a scoped execution path.

Email for a Quote

COMMON QUESTIONS

Working with STMicroelectronics SiGe BiCMOS (B55 / B55X, 300 mm) MPW through TOMPW

Can TOMPW arrange a SiGe BiCMOS (B55 / B55X, 300 mm) MPW shuttle at STMicroelectronics?

Yes. TOMPW coordinates SiGe BiCMOS (B55 / B55X, 300 mm) MPW and shuttle access at STMicroelectronics for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.

What does a SiGe BiCMOS (B55 / B55X, 300 mm) MPW run at STMicroelectronics typically include?

A SiGe BiCMOS (B55 / B55X, 300 mm) MPW run bundles your design onto a shared reticle with other projects, covering mask share, wafer fabrication at STMicroelectronics, and standard probe. Packaging, final test and NTO transition are planned separately with TOMPW.

How long does a SiGe BiCMOS (B55 / B55X, 300 mm) MPW cycle take at STMicroelectronics?

Cycle time depends on STMicroelectronics's shuttle cadence for SiGe BiCMOS (B55 / B55X, 300 mm), usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.

What comes after a SiGe BiCMOS (B55 / B55X, 300 mm) MPW at STMicroelectronics?

After a successful SiGe BiCMOS (B55 / B55X, 300 mm) MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through STMicroelectronics and downstream partners.

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