Skip to main content
TOMPW Service logo
TOMPW
← Back to UMC profile
UMC foundry logo

MPW / Shuttle access

UMC 0.162μm MPW

Plan a 0.162μm multi-project wafer run at UMC through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.

Node: 0.162μmMPW, NTO and production evaluation

Why 0.162μm

0.162μm is one of the process options TOMPW coordinates as a shared-mask MPW run at the partner foundry. We handle slot selection, EDA checks and logistics so your design reaches the line on schedule.

What a 0.162μm MPW at UMC involves

A 0.162μm MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches UMC's line on schedule.

  1. Step 1: GDSII & spec

    Step 1

    GDSII & spec

    Share your GDSII, target node and tape-out window.

  2. Step 2: Slot & mask share

    Step 2

    Slot & mask share

    TOMPW books the next shuttle and aligns mask share.

  3. Step 3: Wafer, package, test

    Step 3

    Wafer, package, test

    Wafers returned, then package/test aligned as needed.

✓MPW shuttle access
✓Mixed-signal platform coordination
✓RF and analog process support
✓Embedded memory integration

Platforms across UMC

Foundry-level platforms, not a list of everything 0.162μm offers. Which of these apply to your 0.162μm run is confirmed per project.

CMOS
BCD
eFlash
RF CMOS
HV CMOS

Notes on working with UMC

  • UMC is especially strong for mixed-signal programs that do not require advanced nodes.
  • TOMPW can coordinate multi-project wafer runs to reduce NRE.

Best-fit applications

Mixed-signal ASIC programsRF and connectivity chipsIndustrial and consumer applicationsCost-sensitive production

Expert reviewed

This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.

Discuss a 0.162μm MPW at UMC

TOMPW Service can coordinate a 0.162μm MPW shuttle with UMC as part of a scoped execution path.

Email for a Quote

COMMON QUESTIONS

Working with UMC 0.162μm MPW through TOMPW

Can TOMPW arrange a 0.162μm MPW shuttle at UMC?

Yes. TOMPW coordinates 0.162μm MPW and shuttle access at UMC for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.

What does a 0.162μm MPW run at UMC typically include?

A 0.162μm MPW run bundles your design onto a shared reticle with other projects, covering mask share and wafer fabrication at UMC. Wafer-level probe is included only on the shuttles that offer it, so we confirm probe coverage for the specific run before you commit. Packaging, final test and the NTO transition are scoped separately with TOMPW.

How long does a 0.162μm MPW cycle take at UMC?

Cycle time depends on UMC's shuttle cadence for 0.162μm, usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.

What comes after a 0.162μm MPW at UMC?

After a successful 0.162μm MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through UMC and downstream partners.

PLAN & ESTIMATE

Calculators for your 0.162μm MPW

Estimate dies per wafer, split shared-mask cost and model unit economics before you commit to a shuttle slot.

RELATED FOUNDRY PROFILES

Other foundries teams compare UMC with

RELATED SERVICES

Services that pair with a UMC 0.162μm MPW

RELATED MPW NODES

Other 0.162μm and UMC MPW access pages

Browse adjacent shuttle nodes so comparison and scheduling research stays on one program path.