MPW / Shuttle access
UMC 0.13μm MPW
Plan a 0.13μm multi-project wafer run at UMC through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.
Why 0.13μm
0.13μm is one of the process options TOMPW coordinates as a shared-mask MPW run at the partner foundry. We handle slot selection, EDA checks and logistics so your design reaches the line on schedule.
What a 0.13μm MPW at UMC involves
A 0.13μm MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches UMC's line on schedule.
Step 1
GDSII & spec
Share your GDSII, target node and tape-out window.
Step 2
Slot & mask share
TOMPW books the next shuttle and aligns mask share.
Step 3
Wafer, package, test
Wafers returned, then package/test aligned as needed.
Technologies & platforms at 0.13μm
Notes for 0.13μm programs
- UMC is especially strong for mixed-signal programs that do not require advanced nodes.
- TOMPW can coordinate multi-project wafer runs to reduce NRE.
- UMC 22nm (22ULR) MPW block is typically ~6 mm²; >10 mm² die may require a multi-block quote — confirm by project.
Best-fit applications
Expert reviewed
This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.
Discuss a 0.13μm MPW at UMC
TOMPW Service can coordinate a 0.13μm MPW shuttle with UMC as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with UMC 0.13μm MPW through TOMPW
Can TOMPW arrange a 0.13μm MPW shuttle at UMC?
Yes. TOMPW coordinates 0.13μm MPW and shuttle access at UMC for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.
What does a 0.13μm MPW run at UMC typically include?
A 0.13μm MPW run bundles your design onto a shared reticle with other projects, covering mask share, wafer fabrication at UMC, and standard probe. Packaging, final test and NTO transition are planned separately with TOMPW.
How long does a 0.13μm MPW cycle take at UMC?
Cycle time depends on UMC's shuttle cadence for 0.13μm, usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.
What comes after a 0.13μm MPW at UMC?
After a successful 0.13μm MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through UMC and downstream partners.
PLAN & ESTIMATE
Calculators for your 0.13μm MPW
Estimate dies per wafer, split shared-mask cost and model unit economics before you commit to a shuttle slot.
Die Per Wafer Calculator
Estimate gross and net dies per wafer from wafer size, die dimensions, scribe lanes, edge exclusion and yield models.
Open tool →MPW Cost Sharing Calculator
Split a shared MPW wafer cost across multiple designs by occupied wafer area — per-participant share and cost.
Open tool →Wafer & Unit Cost Calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open tool →Tape-out Budget Estimator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open tool →RELATED FOUNDRY PROFILES
Other foundries teams compare UMC with
RELATED SERVICES
Services that pair with a UMC 0.13μm MPW
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Plan package type, prototype assembly, inspection and qualification early so silicon delivery does not stall after wafer completion.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →RELATED MPW NODES
Other 0.13μm and UMC MPW access pages
Browse adjacent shuttle nodes so comparison and scheduling research stays on one program path.
UMC other nodes
0.13μm at other foundries
CROSS-FOUNDRY COMPARISON
Compare 0.13μm across foundries
0.13μm MPW is offered by 9 TOMPW-supported foundries including UMC. Use the node comparison tool to see per-foundry shuttle cadence, MPW cost-sharing and ecosystem notes side by side.