MPW / Shuttle access
Silex Microsystems Through-silicon via (TSV) MPW
Plan a Through-silicon via (TSV) multi-project wafer run at Silex Microsystems through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.
Why Through-silicon via (TSV)
Through-silicon via (TSV) is one of the process options TOMPW coordinates as a shared-mask MPW run at the partner foundry. We handle slot selection, EDA checks and logistics so your design reaches the line on schedule.
What a Through-silicon via (TSV) MPW at Silex Microsystems involves
A Through-silicon via (TSV) MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches Silex Microsystems's line on schedule.
Step 1
GDSII & spec
Share your GDSII, target node and tape-out window.
Step 2
Slot & mask share
TOMPW books the next shuttle and aligns mask share.
Step 3
Wafer, package, test
Wafers returned, then package/test aligned as needed.
Platforms across Silex Microsystems
Foundry-level platforms, not a list of everything Through-silicon via (TSV) offers. Which of these apply to your Through-silicon via (TSV) run is confirmed per project.
Notes on working with Silex Microsystems
- Silex is a dedicated MEMS foundry (no standard CMOS MPW shuttle); engagements are process- and design-based.
- TOMPW can help scope a Silex MEMS program from prototyping to volume.
Best-fit applications
Expert reviewed
This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.
Discuss a Through-silicon via (TSV) MPW at Silex Microsystems
TOMPW Service can coordinate a Through-silicon via (TSV) MPW shuttle with Silex Microsystems as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with Silex Microsystems Through-silicon via (TSV) MPW through TOMPW
Can TOMPW arrange a Through-silicon via (TSV) MPW shuttle at Silex Microsystems?
Yes. TOMPW coordinates Through-silicon via (TSV) MPW and shuttle access at Silex Microsystems for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.
What does a Through-silicon via (TSV) MPW run at Silex Microsystems typically include?
A Through-silicon via (TSV) MPW run bundles your design onto a shared reticle with other projects, covering mask share and wafer fabrication at Silex Microsystems. Wafer-level probe is included only on the shuttles that offer it, so we confirm probe coverage for the specific run before you commit. Packaging, final test and the NTO transition are scoped separately with TOMPW.
How long does a Through-silicon via (TSV) MPW cycle take at Silex Microsystems?
Cycle time depends on Silex Microsystems's shuttle cadence for Through-silicon via (TSV), usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.
What comes after a Through-silicon via (TSV) MPW at Silex Microsystems?
After a successful Through-silicon via (TSV) MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through Silex Microsystems and downstream partners.
PLAN & ESTIMATE
Calculators for your Through-silicon via (TSV) MPW
Estimate dies per wafer, split shared-mask cost and model unit economics before you commit to a shuttle slot.
Die Per Wafer Calculator
Count complete dies from Shot/Field layouts with flat or notched wafer boundaries, edge clearance and optional yield estimates.
Open tool →MPW Cost Sharing Calculator
Allocate an agreed MPW shared cost by booked block area and block count, without predicting delivered dies.
Open tool →Wafer & Unit Cost Calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open tool →Tape-out Budget Estimator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open tool →RELATED FOUNDRY PROFILES
Other foundries teams compare Silex Microsystems with
RELATED SERVICES
Services that pair with a Silex Microsystems Through-silicon via (TSV) MPW
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Semiconductor packaging through external assembly and test providers, with TOMPW coordinating package selection, supplier review and assembly-to-test handoff.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →RELATED MPW NODES
Other Through-silicon via (TSV) and Silex Microsystems MPW access pages
Browse adjacent shuttle nodes so comparison and scheduling research stays on one program path.