MPW / Shuttle access
HLMC 40nm MPW
Plan a 40nm multi-project wafer run at HLMC through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.
Why 40nm
40nm is a cost-effective node with a large IP and PDK ecosystem, ideal for mainstream mixed-signal designs. TOMPW coordinates 40nm MPW runs for prototype and low-volume production.
Typical applications
- ✓Connectivity and RF ICs
- ✓PMIC and analog
- ✓Consumer and IoT chips
- ✓Industrial sensors
What a 40nm MPW at HLMC involves
A 40nm MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches HLMC's line on schedule.
Step 1
GDSII & spec
Share your GDSII, target node and tape-out window.
Step 2
Slot & mask share
TOMPW books the next shuttle and aligns mask share.
Step 3
Wafer, package, test
Wafers returned, then package/test aligned as needed.
Platforms across HLMC
Foundry-level platforms, not a list of everything 40nm offers. Which of these apply to your 40nm run is confirmed per project.
Notes on working with HLMC
- HLMC provides mainstream-node coverage complementary to other China-based fabs.
- TOMPW can coordinate HLMC programs for Asia-based supply chains.
Best-fit applications
Expert reviewed
This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.
Discuss a 40nm MPW at HLMC
TOMPW Service can coordinate a 40nm MPW shuttle with HLMC as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with HLMC 40nm MPW through TOMPW
Can TOMPW arrange a 40nm MPW shuttle at HLMC?
Yes. TOMPW coordinates 40nm MPW and shuttle access at HLMC for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.
What does a 40nm MPW run at HLMC typically include?
A 40nm MPW run bundles your design onto a shared reticle with other projects, covering mask share and wafer fabrication at HLMC. Wafer-level probe is included only on the shuttles that offer it, so we confirm probe coverage for the specific run before you commit. Packaging, final test and the NTO transition are scoped separately with TOMPW.
How long does a 40nm MPW cycle take at HLMC?
Cycle time depends on HLMC's shuttle cadence for 40nm, usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.
What comes after a 40nm MPW at HLMC?
After a successful 40nm MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through HLMC and downstream partners.
PLAN & ESTIMATE
Calculators for your 40nm MPW
Estimate dies per wafer, split shared-mask cost and model unit economics before you commit to a shuttle slot.
Die Per Wafer Calculator
Count complete dies from Shot/Field layouts with flat or notched wafer boundaries, edge clearance and optional yield estimates.
Open tool →MPW Cost Sharing Calculator
Allocate an agreed MPW shared cost by booked block area and block count, without predicting delivered dies.
Open tool →Wafer & Unit Cost Calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open tool →Tape-out Budget Estimator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open tool →RELATED FOUNDRY PROFILES
Other foundries teams compare HLMC with
RELATED SERVICES
Services that pair with a HLMC 40nm MPW
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Semiconductor packaging through external assembly and test providers, with TOMPW coordinating package selection, supplier review and assembly-to-test handoff.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →RELATED MPW NODES
Other 40nm and HLMC MPW access pages
Browse adjacent shuttle nodes so comparison and scheduling research stays on one program path.
CROSS-FOUNDRY COMPARISON
Compare 40nm across foundries
40nm MPW is offered by 6 TOMPW-supported foundries including HLMC. Use the node comparison tool to see per-foundry shuttle cadence, MPW cost-sharing and ecosystem notes side by side.