MPW / Shuttle access
Sai Micro Surface / bulk micromachining MPW
Plan a Surface / bulk micromachining multi-project wafer run at Sai Micro through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.
Why Surface / bulk micromachining
Surface / bulk micromachining is one of the process options TOMPW coordinates as a shared-mask MPW run at the partner foundry. We handle slot selection, EDA checks and logistics so your design reaches the line on schedule.
What a Surface / bulk micromachining MPW at Sai Micro involves
A Surface / bulk micromachining MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches Sai Micro's line on schedule.
Step 1
GDSII & spec
Share your GDSII, target node and tape-out window.
Step 2
Slot & mask share
TOMPW books the next shuttle and aligns mask share.
Step 3
Wafer, package, test
Wafers returned, then package/test aligned as needed.
Platforms across Sai Micro
Foundry-level platforms, not a list of everything Surface / bulk micromachining offers. Which of these apply to your Surface / bulk micromachining run is confirmed per project.
Notes on working with Sai Micro
- Sai Micro is the China-based MEMS manufacturing arm of Sai MicroElectronics; Silex Microsystems (Sweden, already a TOMPW partner) is its subsidiary.
- MEMS engagements are process- and design-based rather than standard CMOS MPW shuttles; TOMPW can help scope a Sai Micro MEMS program.
Best-fit applications
Expert reviewed
This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.
Discuss a Surface / bulk micromachining MPW at Sai Micro
TOMPW Service can coordinate a Surface / bulk micromachining MPW shuttle with Sai Micro as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with Sai Micro Surface / bulk micromachining MPW through TOMPW
Can TOMPW arrange a Surface / bulk micromachining MPW shuttle at Sai Micro?
Yes. TOMPW coordinates Surface / bulk micromachining MPW and shuttle access at Sai Micro for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.
What does a Surface / bulk micromachining MPW run at Sai Micro typically include?
A Surface / bulk micromachining MPW run bundles your design onto a shared reticle with other projects, covering mask share and wafer fabrication at Sai Micro. Wafer-level probe is included only on the shuttles that offer it, so we confirm probe coverage for the specific run before you commit. Packaging, final test and the NTO transition are scoped separately with TOMPW.
How long does a Surface / bulk micromachining MPW cycle take at Sai Micro?
Cycle time depends on Sai Micro's shuttle cadence for Surface / bulk micromachining, usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.
What comes after a Surface / bulk micromachining MPW at Sai Micro?
After a successful Surface / bulk micromachining MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through Sai Micro and downstream partners.
PLAN & ESTIMATE
Calculators for your Surface / bulk micromachining MPW
Estimate dies per wafer, split shared-mask cost and model unit economics before you commit to a shuttle slot.
Die Per Wafer Calculator
Count complete dies from Shot/Field layouts with flat or notched wafer boundaries, edge clearance and optional yield estimates.
Open tool →MPW Cost Sharing Calculator
Allocate an agreed MPW shared cost by booked block area and block count, without predicting delivered dies.
Open tool →Wafer & Unit Cost Calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open tool →Tape-out Budget Estimator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open tool →RELATED FOUNDRY PROFILES
Other foundries teams compare Sai Micro with
RELATED SERVICES
Services that pair with a Sai Micro Surface / bulk micromachining MPW
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Semiconductor packaging through external assembly and test providers, with TOMPW coordinating package selection, supplier review and assembly-to-test handoff.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →RELATED MPW NODES
Other Surface / bulk micromachining and Sai Micro MPW access pages
Browse adjacent shuttle nodes so comparison and scheduling research stays on one program path.