MPW / Shuttle access

Sai Micro Surface / bulk micromachining MPW

Plan a Surface / bulk micromachining multi-project wafer run at Sai Micro through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.

Node: Surface / bulk micromachiningMPW, NTO and production evaluation

Why Surface / bulk micromachining

Surface / bulk micromachining is one of the process options TOMPW coordinates as a shared-mask MPW run at the partner foundry. We handle slot selection, EDA checks and logistics so your design reaches the line on schedule.

What a Surface / bulk micromachining MPW at Sai Micro involves

A Surface / bulk micromachining MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches Sai Micro's line on schedule.

✓Pure-play MEMS foundry (Beijing 8-inch line)

✓MEMS process development and volume production

✓Wafer-level MEMS packaging

✓Design-enablement and EDA support

Technologies & platforms at Surface / bulk micromachining

MEMS

Sensor fabrication

BAW filters

Optical MEMS / micro-mirror

Micro-fluidics

Wafer-level packaging

Notes for Surface / bulk micromachining programs

Sai Micro is the China-based MEMS manufacturing arm of Sai MicroElectronics; Silex Microsystems (Sweden, already a TOMPW partner) is its subsidiary.
MEMS engagements are process- and design-based rather than standard CMOS MPW shuttles; TOMPW can help scope a Sai Micro MEMS program.

Best-fit applications

Inertial and pressure sensorsBAW / RF filtersOptical MEMS and LiDARBioMEMS and medical devicesMEMS foundry engagement

Expert reviewed

This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.

Discuss a Surface / bulk micromachining MPW at Sai Micro

TOMPW Service can coordinate a Surface / bulk micromachining MPW shuttle with Sai Micro as part of a scoped execution path.

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COMMON QUESTIONS

Working with Sai Micro Surface / bulk micromachining MPW through TOMPW

Can TOMPW arrange a Surface / bulk micromachining MPW shuttle at Sai Micro?

Yes. TOMPW coordinates Surface / bulk micromachining MPW and shuttle access at Sai Micro for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.

What does a Surface / bulk micromachining MPW run at Sai Micro typically include?

A Surface / bulk micromachining MPW run bundles your design onto a shared reticle with other projects, covering mask share, wafer fabrication at Sai Micro, and standard probe. Packaging, final test and NTO transition are planned separately with TOMPW.

How long does a Surface / bulk micromachining MPW cycle take at Sai Micro?

Cycle time depends on Sai Micro's shuttle cadence for Surface / bulk micromachining, usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.

What comes after a Surface / bulk micromachining MPW at Sai Micro?

After a successful Surface / bulk micromachining MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through Sai Micro and downstream partners.

RELATED FOUNDRY PROFILES

Other foundries teams compare Sai Micro with

Silex MicrosystemsMPW & access →SMICMPW & access →TowerMPW & access →X-FABMPW & access →

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