MPW / Shuttle access
TSMC 16nm MPW
Plan a 16nm multi-project wafer run at TSMC through TOMPW Service. We coordinate shared-mask access, EDA sign-off, shuttle scheduling and the downstream packaging or test path for global chip teams.
Why 16nm
16nm is a mature FinFET node widely used for performance ASICs with a rich IP portfolio. TOMPW coordinates 16nm MPW access and tape-out checks for first-silicon validation.
Typical applications
- ✓Networking and baseband
- ✓Automotive compute
- ✓Consumer SoCs
What a 16nm MPW at TSMC involves
A 16nm MPW (multi-project wafer) shuttle places several customer designs on one shared mask set, so each team pays only for its portion of the wafer. TOMPW Service handles slot selection, DRC/LVS review and logistics so your GDSII reaches TSMC's line on schedule.
Step 1
GDSII & spec
Share your GDSII, target node and tape-out window.
Step 2
Slot & mask share
TOMPW books the next shuttle and aligns mask share.
Step 3
Wafer, package, test
Wafers returned, then package/test aligned as needed.
Technologies & platforms at 16nm
Notes for 16nm programs
- Advanced node programs are evaluated case by case based on schedule and commercial model.
- TOMPW helps coordinate MPW to production transition on TSMC nodes.
- TSMC 22nm (22ULP / 22ULL) MPW block is typically ~6 mm²; >10 mm² die may require a multi-block quote — confirm by project.
Best-fit applications
Expert reviewed
This page is reviewed by Henry, CEO, TOMPW Service. Henry is the CEO of TOMPW Service and a chip-design specialist with 20 years in the semiconductor industry.
Discuss a 16nm MPW at TSMC
TOMPW Service can coordinate a 16nm MPW shuttle with TSMC as part of a scoped execution path.
Email for a QuoteCOMMON QUESTIONS
Working with TSMC 16nm MPW through TOMPW
Can TOMPW arrange a 16nm MPW shuttle at TSMC?
Yes. TOMPW coordinates 16nm MPW and shuttle access at TSMC for overseas teams, handling slot selection, EDA checks and logistics so your design reaches the shared mask on schedule.
What does a 16nm MPW run at TSMC typically include?
A 16nm MPW run bundles your design onto a shared reticle with other projects, covering mask share, wafer fabrication at TSMC, and standard probe. Packaging, final test and NTO transition are planned separately with TOMPW.
How long does a 16nm MPW cycle take at TSMC?
Cycle time depends on TSMC's shuttle cadence for 16nm, usually a few months from mask data to returned wafers. Missing a window means waiting for the next one, so TOMPW recommends booking early.
What comes after a 16nm MPW at TSMC?
After a successful 16nm MPW, teams typically move to NTO or full-mask production. TOMPW helps plan that transition, including package selection, test development and volume ramp through TSMC and downstream partners.
PLAN & ESTIMATE
Calculators for your 16nm MPW
Estimate dies per wafer, split shared-mask cost and model unit economics before you commit to a shuttle slot.
Die Per Wafer Calculator
Estimate gross and net dies per wafer from wafer size, die dimensions, scribe lanes, edge exclusion and yield models.
Open tool →MPW Cost Sharing Calculator
Split a shared MPW wafer cost across multiple designs by occupied wafer area — per-participant share and cost.
Open tool →Wafer & Unit Cost Calculator
Turn a wafer run into a per-chip cost: dies per wafer, yield, packaging and test, plus a target margin.
Open tool →Tape-out Budget Estimator
Full program model: DPW, yield, packaging, HBM, test, NRE and volume → unit cost, price and gross margin.
Open tool →RELATED FOUNDRY PROFILES
Other foundries teams compare TSMC with
RELATED SERVICES
Services that pair with a TSMC 16nm MPW
MPW / Fab Shuttle
Compare public shuttle windows across foundries, control first-silicon cost and move from tape-out planning to wafer delivery with one execution path.
Learn more →Full Mask / Production Foundry
Move validated designs into dedicated mask production with yield, volume and supply planning support.
Learn more →Semiconductor Packaging
Plan package type, prototype assembly, inspection and qualification early so silicon delivery does not stall after wafer completion.
Learn more →Test & Product Engineering
Connect CP, FT and reliability planning so packaged silicon is measurable, debuggable and ready for customer evaluation.
Learn more →Turnkey ASIC Solutions
Unify design support, tape-out, packaging, test, board work and delivery under one execution-facing partner.
Learn more →RELATED MPW NODES
Other 16nm and TSMC MPW access pages
Browse adjacent shuttle nodes so comparison and scheduling research stays on one program path.